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Wafer transmission system and semiconductor equipment

A transmission system and semiconductor technology, applied in the field of semiconductor equipment, can solve problems such as chip loss or fragmentation, achieve the effects of avoiding chip loss or fragmentation, real-time and efficient detection, and improving reliability

Pending Publication Date: 2022-05-13
上海果纳半导体技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to disclose a wafer transfer system and a semiconductor device based on the wafer transfer system, so as to solve the problem of chip dropping or fragments that may occur during the process of grabbing and transferring wafers in the traditional wafer transfer system and other adverse phenomena, realize the clamping operation for wafers of different thicknesses, and improve the reliability of the wafer transfer system for wafer clamping operations

Method used

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  • Wafer transmission system and semiconductor equipment
  • Wafer transmission system and semiconductor equipment
  • Wafer transmission system and semiconductor equipment

Examples

Experimental program
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Embodiment 1

[0045] ginseng Figure 1 to Figure 11 The disclosed first embodiment of a wafer transfer system of the present invention.

[0046]In this embodiment, a wafer transfer system includes: a buffer table 34 , a plurality of pressure detection units 35 arranged above the buffer table 34 for detecting the weight of the wafer, a photoelectric detection unit, and a pick-up unit. The pick-up unit includes two rotating grabbing plates 40 arranged in parallel. At least one side of the rotating grabbing plate 40 along its extension direction forms a fixed fork portion 42 supporting the edge of the wafer and having a first notch 420. Picking up The unit detects and sends the detection signal according to the photoelectric detection unit and the pressure detection unit to determine that the axial rotation angle of the rotary grabbing plate 40 is along the Figure 4 The rotation angle formed by the axis A turning in the direction shown by the arrow B. Preferably, the picking unit further in...

Embodiment 2

[0070] ginseng Figure 12 As shown, this embodiment discloses another specific implementation manner of a wafer transport system. The main difference between this embodiment and the wafer transfer system disclosed in Embodiment 1 is that in this embodiment, the pick-up unit includes two rows of movable forks arranged on the fixed forks, and the two rows of movable forks It is arranged on two opposite and different sides of the rotary grabbing plate 40 .

[0071] Specifically, in this embodiment, the movable fork 45a and the movable fork 43a are respectively located on two opposite sides of the substrate 41a, and the movable fork 45a and the movable fork can be driven according to the actual thickness data of the wafer 50. 43a is extended or retracted in the directions shown by arrow D and arrow D' respectively, so as to select the first notch 420 or the second notch 433 (or the second notch 453 ) of the opening size that best matches the thickness of the wafer 50 .

[0072]...

Embodiment 3

[0075] ginseng Figure 13 As shown, this embodiment discloses another specific implementation manner of a wafer transport system. The main difference between this embodiment and the wafer transfer system disclosed in Embodiment 2 is that in this embodiment, the pick-up unit includes a row of movable forks disposed on the fixed forks.

[0076] Specifically, in this embodiment, the movable forks 45a are respectively located on any side of the substrate 41b, and according to the actual thickness data of the wafer 50, the movable forks 45a can be driven to elongate in the direction shown by the arrow D or The first notch 420 or the second notch 433 that is retracted so as to select the opening size that best matches the thickness of the wafer 50 jointly supports the bottom edge of the wafer 50 to clamp and grasp the wafer 50 together.

[0077] The wafer transfer system shown in this embodiment has the same technical solutions as the wafer transfer system shown in Embodiment 1 and...

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Abstract

The invention provides a wafer transmission system and semiconductor equipment. The wafer transmission system comprises a cache table, a plurality of pressure detection units, a photoelectric detection unit and a pickup unit, wherein the pressure detection units are arranged above the cache table and used for detecting the weight of wafers; the picking unit comprises two rotary grabbing plates which are arranged in parallel, at least one side edge of each rotary grabbing plate in the extending direction forms a fixed fork tooth part which supports the edge of a wafer and is provided with a first notch, and two connecting arms which are connected with the ends of the rotary grabbing plates. The picking unit determines the axial rotation angle of the rotary grabbing plate according to detection signals sent by the photoelectric detection unit and the pressure detection unit. According to the wafer transmission system disclosed by the invention, the undesirable phenomena of wafer falling or wafer breaking and the like possibly occurring in the process of grabbing and transmitting the wafers by the wafer transmission system are avoided, the wafers with different thicknesses are clamped, and the reliability of the wafer clamping operation is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a wafer transmission system and semiconductor equipment. Background technique [0002] Wafer Transfer System (WTS) is mainly used for batch transfer of wafers on Diffusion Furnace and Bench Wet Clean. The WTS system can usually pick and place 25 wafers at a time. In the production process of some semiconductor manufacturing processes, the back of the wafer needs to be ground. After the back grinding process is completed, the WTS system generally needs to transfer the wafer to the wafer cleaning device for the cleaning process. [0003] The WTS system includes a buffer station and a robot. The wafer temporary storage area is mainly used as a transfer station or temporary storage station for wafers. It is mostly used for anti-pollution isolation of pre-processing and post-processing wafers or for converging and integrating devices that transfer more than 25 wafers....

Claims

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Application Information

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IPC IPC(8): H01L21/677H01L21/67
CPCH01L21/6773H01L21/67712H01L21/67736H01L21/67011H01L21/67259H01L21/67288
Inventor 毕迪
Owner 上海果纳半导体技术有限公司
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