Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Model mapping method and device and electronic equipment

A technology of textures and models, applied in image data processing, 3D image processing, indoor games, etc., can solve problems affecting the accuracy of textures, modification, cumbersome textures, etc., and achieve the effect of improving the accuracy of textures and simplifying the process of textures

Pending Publication Date: 2022-05-10
NETEASE (HANGZHOU) NETWORK CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this method, the preset textures can only be mixed into the 2D unfolded image of the target model in the texture drawing software. The texture process is cumbersome, and the preset textures and blending effects cannot be modified in the game engine. The resolution of the two-dimensional expanded image is small, which affects the final texture accuracy

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Model mapping method and device and electronic equipment
  • Model mapping method and device and electronic equipment
  • Model mapping method and device and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0045] (1) Calculate the first value of each vertex color parameter according to the first preset formula and the specified texture parameters;

[0046] The above-mentioned first preset formula is: IDL=saturate(VC*f–(ID–n)); wherein, VC represents the vertex color parameter; f represents the magnification ratio of the parameter; ID represents the target map parameter; n is the value of the preset formula Formula parameter; IDL indicates the first value of the vertex color parameter; IDH indicates the second value of the vertex color parameter; saturate indicates returning a value between 0 and 1. Among them, the function of saturate(x) is that if the value of x is less than 0, the return value is 0. If x takes a value greater than 1, the return value is 1. If x is between 0 and 1, the value of x is returned directly.

[0047] Taking the maximum texture parameter of 40 as an example, the above f can be 40; n can be 2. Specifically, the texture parameter corresponding to the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a model mapping method and device and electronic equipment. The method comprises the following steps: acquiring vertex color parameters of a target model; wherein the vertex color parameter is used for indicating the mapping material type of the vertex position where the vertex color parameter is located; according to the vertex color parameters, the model surface of the target model is divided into at least one mapping area, and the vertex color parameters in the same mapping area are the same; and obtaining a target mapping material corresponding to the vertex color parameter in the mapping area, and performing mapping processing on the mapping area based on the target mapping material to obtain a mapped target model. In the mode, different types of chartlets are recorded through the vertex color parameters of the model, the chartlet area of each type of chartlet material can be divided on the surface of the model according to the vertex color parameters only in the game engine, the target chartlet material is drawn to the corresponding chartlet area, the chartlet picture does not need to be output independently, the model chartlet process is simplified, and the model chartlet efficiency is improved. And the mapping precision of the model is improved.

Description

technical field [0001] The invention relates to the technical field of model making, in particular to a model mapping method, device and electronic equipment. Background technique [0002] At present, in the process of making 3D game models, it is usually necessary to mix different textures for the model. In related technologies, firstly, through model making software, such as Maya software, the target model is subjected to UV unfolding processing, that is, a two-dimensional unfolded map of the target model is created, and the corresponding data of the relationship between the vertices in the three-dimensional space and the space of the two-dimensional unfolded map is obtained. Then input the 2D expanded image, target model and preset texture into the texture drawing software, mix the preset texture into the 2D expanded image of the target model through the texture drawing software, and mix the 2D texture with the preset texture The target model created in the expansion dia...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06T15/04G06T15/00A63F13/52
CPCG06T15/04G06T15/005A63F13/52
Inventor 赵鸣
Owner NETEASE (HANGZHOU) NETWORK CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com