Three-dimensional structure electronic device, manufacturing method and device

Abstract

The invention relates to a three-dimensional structure electronic device and a manufacturing method and device, and the method comprises the following steps: S1, designing a three-dimensional model of the three-dimensional structure electronic device, and reserving a via hole position; s2, performing layering processing on the three-dimensional model; s3, the mixed slurry is laid on a workbench and cured to form a first base body layer, and a first conductor layer comprises a radiation structure formed at the position of the via hole; s4, spraying a binding agent on the first matrix layer to form a first binding layer; s5, spraying conductive slurry on the first bonding layer to form a first conductor layer; s6, spraying a binding agent on the first conductor layer to form a second binding layer; and S7, the steps S3-S6 are repeatedly executed until the nth conductor layer and the (n + 1) th substrate layer are completed, and the three-dimensional structure electronic device is obtained. And S8, cleaning the three-dimensional structure electronic device, and bending the radiation structure at the position of the via hole. By controlling the technological process, manufacturing of the structure-function integrated three-dimensional structure electronic device is achieved, and interconnection between conductor layers can be achieved without independently plating copper in the via hole.

Description

technical field [0001] The invention relates to the technical field of structural electronic circuits, in particular to three-dimensional structural electronic devices, manufacturing methods and devices. Background technique [0002] With the increasing complexity and rich functions of modern electronic systems, new functional-structural three-dimensional circuits based on the integration of electronic circuits and functional structures are increasingly widely used. Different from traditional electronic circuit devices, three-dimensional circuits usually need to integrate various components such as sensor elements, actuators, control circuits, communication antennas and energy supply units in an extremely compact space. The space for accommodating electronic circuits is extremely limited. This makes the circuit board based on plane printing unable to meet the requirements of the three-dimensional circuit. The current methods used to manufacture three-dimensional circuits ca...

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Problems solved by technology

[0003] Based on this, it is necessary to provide a three-dimensional structure electronic device, manufacturing method and device for the problem that the existing technology cannot meet the problem of three-dimensional device manufacturing with functional structure integration

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