Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Drainage device for semiconductor process equipment and semiconductor process equipment

A technology of process equipment and drainage device, which is applied in semiconductor/solid-state device manufacturing, lighting and heating equipment, electrical components, etc., can solve the problem of unstable pressure in the water collection box, and achieve the effect of simple control mode

Pending Publication Date: 2022-03-22
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention discloses a drainage device for semiconductor process equipment and semiconductor process equipment to solve the problem that the pressure in the water collection box is unstable when the water collection box is draining water

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Drainage device for semiconductor process equipment and semiconductor process equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] The technical solutions disclosed by various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0025] Please refer to figure 1 , the embodiment of the present invention discloses a drainage device for semiconductor process equipment and semiconductor process equipment. The disclosed drai...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The drainage device comprises a water collecting box and a drainage mechanism, the drainage mechanism comprises a cylinder body, a piston, a first one-way valve and a second one-way valve, the piston is arranged in the cylinder body in a sliding mode, the piston and the cylinder body can form a temporary storage space, the water collecting box is communicated with the temporary storage space through a water inlet pipe, and the first one-way valve and the second one-way valve are arranged in the water collecting box. The cylinder body is provided with a drainage pipe, and the second one-way valve is arranged on the drainage pipe; under the condition that the piston moves in the first direction, the first one-way valve is opened, and the second one-way valve is closed; under the condition that the piston moves in the second direction, the piston extrudes the temporary storage space so that water in the temporary storage space can drive the first one-way valve to be closed and the second one-way valve to be opened, and the first direction is opposite to the second direction. According to the scheme, the problem that when the water collecting box drains water, the pressure in the water collecting box is unstable can be solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a drainage device for semiconductor process equipment and semiconductor process equipment. Background technique [0002] When semiconductor process equipment processes semiconductor devices, it usually needs to be carried out in a process chamber that meets the process environment. The pressure of the process chamber is crucial to the process accuracy of semiconductor devices. [0003] Semiconductor process equipment will generate condensed water during the process. In related technologies, the condensed water generated by semiconductor process equipment needs to be collected in a water collection box through a water inlet pipe. Since the water inlet pipe connects the semiconductor process equipment with the water collection box, the water collection box is only connected with the semiconductor process equipment during the process of collecting condensed water in...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): F28B9/08H01L21/67
CPCF28B9/08H01L21/67011
Inventor 陈振伟石磊
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products