Inductor component and method for manufacturing inductor component

Abstract

Provided is a thin inductor component. The element (BD) has a main surface and a side surface perpendicular to the main surface. The inductor wiring (20) extends parallel to the main surface within the body (BD). The first vertical wiring (71) extends from the inductor wiring (20) in a direction toward the main surface, and the first support wiring (41) extends parallel to the main surface. The inductor wiring (20) has a wiring main body (21) and a first pad (22) provided at an end portion of the wiring main body (21). A first vertical wiring (71) and a first support wiring (41) are connected to the first pad (22). The first support wiring (41) is disposed on the opposite side of the wiring main body (21) with the first pad (22) therebetween. When a virtual tangent line D1 is drawn at a connection position between the wiring main body 21 and the first pad 22 with respect to a central axis C1 of the wiring main body 21 when viewed from the thickness direction, the first support wiring 41 extends parallel to the virtual tangent line D1 from the first pad 22, and a central axis A1 of the first support wiring 41 and the virtual tangent line D1 are located on different straight lines.

Description

technical field [0001] The present disclosure relates to an inductor component, and a method of manufacturing the inductor component. Background technique [0002] In the inductor component disclosed in Patent Document 1, an insulating substrate is arranged inside a body. Inductor wiring is laminated on both surfaces in the thickness direction of the insulating substrate. In addition, the protrusion protrudes from the edge of the insulating substrate. The protrusion is integral with the insulating substrate, and is located on the same layer as the insulating substrate. The front end of the protrusion is exposed on the surface of the green body. [0003] The above-described inductor components are formed by dicing a mother substrate to which a plurality of inductor components are bonded. In the state of the mother substrate, the insulating substrates of the respective inductor components are connected to each other by rods. When dicing the motherboard, the above-mentione...

AI Technical Summary

Problems solved by technology

However, due to the existence of the insulating substrate on which the rods and protrusions are formed, the thickness of the inductor part increases accordingly.

Therefore, it is considered to remove the insulating substrate and use the inductor wiring itself instead of the rods and protrusions. However, since the mechanical functions required for the rods and protrusions are different from the electrical functions required for the inductor wiring, it is difficult to make both. optimize

Images