Insulation board laying device for floor heating

Abstract

The invention relates to an insulation board laying device for floor heating, and relates to the technical field of insulation board laying. The insulation board laying device for floor heating comprises a movable frame, the movable frame is provided with a ground leveling device, a floor mat laying device and a glue solution coating device, the ground leveling device comprises an impurity removal mechanism and a dust suction mechanism, the impurity removal mechanism is used for removing protruding impurities on the ground, the dust suction mechanism is used for sucking and removing sundries, the floor mat laying device comprises a mat conveying mechanism and a flattening mechanism, the mat conveying mechanism conveys a floor mat to the ground, the flattening mechanism compacts the floor mat on the ground, the glue solution coating device is used for coating the floor mat with glue, and a containing box used for stacking insulation boards is arranged at the top of the movable frame. The process of removing sundries on the ground, laying the ground mat and coating the glue solution is continuously carried out, the working efficiency is effectively improved, after the glue solution coating is completed, the insulation board in the containing box can be laid on the ground mat coated with the glue solution, the operation is simple and rapid, and the efficiency is high.

Description

technical field [0001] The present application relates to the technical field of laying thermal insulation boards, in particular to a thermal insulation board laying device for floor heating. Background technique [0002] Water floor heating is mainly composed of heat source equipment, main pipes, sub-collectors, floor heating coils, and thermostats. It provides hot water with a temperature not higher than 60°C through heat source equipment, and distributes the hot water in the system evenly to each branch under the action of the sub-collector, circulates in the floor heating pipe, and then realizes it through the hydraulic action of the water pump. Redistributed, thereby heating the entire floor, giving users a warm indoor experience. [0003] Since the heating pipes for geothermal heating are arranged under the ground, the upper part of the heating pipe is only 20-40mm from the ground, so nails cannot be used to fix the floor when laying the floor. At the same time, the g...

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Problems solved by technology

[0003] Since the heating pipes for geothermal heating are arranged under the ground, the upper part of the heating pipe is only 20-40mm from the ground, so nails cannot be used to fix the floor when laying the floor. At the same time, the ground must be cleaned before laying the floor to ensure that there is no floating soil on the ground , sand, protrusions, clean, and cut the door cover, the ground can be paved only after the ground is qualified. Due to the large amount of moisture released by hydrothermal radiation heating, it is necessary to lay a special paper mat between the base and the insulation board. The process requires the staff to clean up the burrs, bumps, sand and other debris on the ground first, then lay the special paper mat and arrange it level, and then the staff need to coat the adhesive on the paper mat, and finally lay the Insulation board; the whole process is complicated, the labor intensity of workers is high and the efficiency is low

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