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Sandwich structure with low-specific-modulus insertion layer and preparation method of sandwich structure

A sandwich structure and interlayer technology, which is applied in the field of sandwich structures with low specific modulus insert layers and its preparation, can solve the problems of poor acoustic performance, improve sound insulation performance, reduce sound radiation, and reduce shear modulus Effect

Pending Publication Date: 2022-02-25
QINGDAO TECHNOLOGICAL UNIVERSITY
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] The main purpose of this application is to solve the problem of poor acoustic performance of traditional lightweight sandwich panels, and to propose a sandwich structure with a low specific modulus insertion layer and its preparation method

Method used

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  • Sandwich structure with low-specific-modulus insertion layer and preparation method of sandwich structure

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Embodiment Construction

[0021] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0022] In the description of this application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", The orientations or positional relationships indicated by "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the application and simplifying the description, rather...

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Abstract

The invention provides a sandwich structure with a low-specific-modulus insertion layer and a preparation method of the sandwich structure. The sandwich structure sequentially comprises an upper panel, a light thick core layer, the low-specific-modulus insertion layer, a light thick core layer and a lower panel from top to bottom. The problem that a traditional light sandwich panel is poor in acoustic performance is solved, and the sandwich structure is simple, high in static rigidity, low in dynamic rigidity and excellent in acoustic performance.

Description

technical field [0001] The application belongs to the field of multilayer materials, in particular to a sandwich structure with a low specific modulus insertion layer and a preparation method thereof. Background technique [0002] Due to the excellent characteristics of light weight and high rigidity of the lightweight sandwich structure, it has been widely used, but its acoustic vibration transmission characteristics have received extensive attention. Since the noise generated during its application is easily transmitted to the inside and outside of the structure, For example, during the high-speed flight of the aircraft, a turbulent boundary layer will be formed on the outer surface, which will generate very strong random excitation and radiate noise to the fuselage shell structure, and generate very strong random excitation and radiate noise to the fuselage shell structure. [0003] If the structure is not properly designed or proper noise reduction treatment is not taken...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B5/18B32B25/04B32B25/20B32B7/12B32B33/00
CPCB32B5/18B32B25/045B32B25/20B32B7/12B32B33/00B32B2307/546B32B2307/102B32B2307/51B32B2250/40
Inventor 康鲁迪刘碧龙孙成溥李新武倩倩
Owner QINGDAO TECHNOLOGICAL UNIVERSITY
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