Reflow soldering device of low-loss Schottky rectifier tube

Abstract

The invention relates to the field of Schottky rectifier tube welding, in particular to a reflow soldering device of a low-loss Schottky rectifier tube. The reflow soldering device comprises a machine frame, a continuous conveying mechanism, a positioning and clamping mechanism and a reflow soldering mechanism, wherein the continuous conveying mechanism, the positioning and clamping mechanism and the reflow soldering mechanism are located above the machine frame, the continuous conveying mechanism comprises a turntable and a working platform, the working platform is provided with a plurality of through mounting ports for mounting the positioning and clamping mechanism, the reflow soldering mechanism comprises a preheating assembly, a constant temperature assembly, a reflow soldering assembly and a cooling assembly, the positioning and clamping mechanism comprises a mounting frame, a bearing assembly and a clamping assembly, the bearing assembly is horizontally arranged on the mounting frame, the clamping assembly is arranged above the bearing assembly, and one side of the clamping assembly is hinged to the top end of the bearing assembly. Continuous welding operation is achieved, the possibility of energy waste is reduced, the function of accurately clamping circuit boards of different models and sizes can be achieved through the positioning and clamping mechanism, and the machining range of equipment is widened.

Description

technical field [0001] The invention relates to the field of Schottky rectifier welding, in particular to a low-loss Schottky rectifier reflow soldering device. Background technique [0002] The Schottky rectifier is also a Schottky diode. The Schottky diode is a noble metal (gold, silver, aluminum, platinum, etc.) A as the positive pole, and an N-type semiconductor B as the negative pole. Using the potential barrier formed on the contact surface of the two A metal-semiconductor device made with rectifying properties. Because there are a large number of electrons in the N-type semiconductor and only a small amount of free electrons in the noble metal, the electrons diffuse from B with high concentration to A with low concentration. Obviously, there are no holes in metal A, and there is no diffusion of holes from A to B. As electrons continue to diffuse from B to A, the electron concentration on the surface of B gradually decreases, and the surface electrical neutrality is ...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, reflow soldering technology is often used to solder the Schottky rectifier to the circuit board, and the air or nitrogen is heated to a high enough temperature and then blown to the circuit board on which the components have been pasted, so that the Schottky rectifier The solder on the side melts and bonds with the main board to realize the welding operation of the Schottky rectifier tube and the circuit board. However, in the prior art, the unloading operation of the circuit board is very cumbersome, and it needs to be repeatedly driven on the guide rail before unloading. It is not conducive to the continuity of production; the loading and unloading time of the circuit board is long, which leads to the waste of energy inside the reflow soldering equipment; the device for fixing the circuit board is not strong in adjustment ability, which makes it unable to adapt to the fixed installation process of different types of circuit boards

Images