Penetration type heat dissipation device for tested board card chip

Abstract

The invention relates to a penetration type heat dissipation device for a tested board card chip. The penetration type heat dissipation device comprises a penetration type heat dissipation module; the penetrating type heat dissipation module comprises a penetrating type heat dissipation block; the penetrating type heat dissipation block comprises a penetrating type column, a heat dissipation block contact boss is arranged at the lower end of the penetrating type column, a heat dissipation block guide column is arranged at the upper end of the penetrating type column, an installation threaded hole is formed in the inner side of the heat dissipation block guide column, and a heat dissipation block floating spring is arranged on the outer side of the heat dissipation block guide column in a sleeving mode. The heat dissipation block guide column of the penetrating type heat dissipation block penetrates through a through hole of a wind scooper, a heat dissipation block guide groove is further formed in a heat dissipation module base plate, and a heat dissipation block equal-height screw penetrates through the heat dissipation block guide groove to be in threaded connection with an installation threaded hole of the heat dissipation block guide column, so that the penetrating type heat dissipation block is fixed to the heat dissipation module base plate. According to the invention, the heat generated by a chip on the back surface of a tested board card is transmitted to a penetrating type square column through a heat conduction indium sheet, and the heat is transmitted to radiating fins at the tail end of the penetrating type square column through the penetrating type square column.

Description

technical field [0001] The invention relates to the technical field of heat dissipation devices, in particular to a penetrating heat dissipation device for a board chip under test. Background technique [0002] With the rapid development of electronic product technology and the increasing requirements for process efficiency and yield, the electronics industry has gradually begun to strengthen the development and optimization of product functional testing equipment while improving the process efficiency of electronic products. Among them, the demand for functional testing of electronic product motherboards is the most urgent. In the process of testing high-performance chips, the heat dissipation efficiency of the heat dissipation module of the chip is the most critical. [0003] The chip of the board under test is divided into two types, one is the chip on the front of the board under test, and the other is the chip on the back of the board under test. For the heat dissipat...

AI Technical Summary

Problems solved by technology

[0004] First, the inner cavity of the needle carrier is designed to install an air duct cooling device, the cooling air will always accumulate in the inner cavity of the needle carrier, and the heat cannot be dissipated

[0005] Second, in order to ensure the air volume of the air duct blowing and heat dissipation scheme, it is generally necessary to introduce air compression equipment, and the needle carrier board needs to reserve a large inner cavity for the installation of related air duct components. The inner cavity area is very easy to test the overlap of pinhole positions. Directly affect the needle of the test point, and the ability to be compatible with different chips of the tested product is poor

[0006] Third, the structure of air duct components and air compression equipment is complex, and its installation and design are difficult, which increases design and processing costs

At the same time, disassembly and assembly are complicated, which is not conducive to disassembly and maintenance

[0007] Fourth, for the backside chip with high working power and high heat generation, the air duct blowing heat dissipation method will not meet the heat dissipation requirements, resulting in poor testing and even the risk of burning the board

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