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Housings and Electronics

A technology of electronic equipment and housing, which is applied in the field of electronic products, can solve the problems of poor heat dissipation performance of the housing, and achieve the effect of improving strength, performance and service life, and improving heat dissipation effect

Active Publication Date: 2022-04-22
HONOR DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present application provides a casing to solve the technical problem of poor heat dissipation performance of the casing in the prior art

Method used

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  • Housings and Electronics
  • Housings and Electronics
  • Housings and Electronics

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Experimental program
Comparison scheme
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Embodiment Construction

[0033] Embodiments of the present application are described below with reference to the drawings in the embodiments of the present application.

[0034] see figure 1 , figure 1 is a schematic structural diagram of the electronic device 200 provided in this application.

[0035] The electronic device 200 includes, but is not limited to, a cell phone, a notebook computer, a tablet personal computer, a laptop computer, a personal digital assistant, or a wearable device ( wearable device) etc. In the following description, the electronic device 200 is a mobile phone.

[0036] The electronic device 200 includes a body 110 and a casing 100 , and the casing 100 is installed on the body 110 . The casing 100 is a battery cover of the electronic device 200 . The structure of the casing 100 will be described in detail below.

[0037]For ease of description, in this application, the width direction of the casing 100 is defined as the X direction, the length direction is defined as t...

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PUM

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Abstract

The application provides a housing and electronic equipment. The casing includes a first support plate, a second support plate and a heat vapor chamber. The first support plate, the heat soaking plate and the second support plate are stacked, and the heat soaking plate is located between the first support plate and the second support plate, and connected with the first support plate and the second support plate. A heat dissipation channel is provided in the vapor chamber, and the heat dissipation channel includes a main heat dissipation channel and an auxiliary heat dissipation channel, the main heat dissipation channel and the auxiliary heat dissipation channel are connected, and heat exchange can occur between the main heat dissipation channel and the auxiliary heat dissipation channel. The housing provided by the present application solves the technical problem of poor heat dissipation performance of the housing in the prior art.

Description

technical field [0001] The present application relates to the technical field of electronic products, in particular to a casing and electronic equipment. Background technique [0002] With the development of science and technology, electronic devices (such as mobile phones, tablet computers, etc.) are gradually becoming thinner and lighter. The back cover made of plastic is conducive to the thinning of electronic equipment, and the thermal conductivity of plastic is poor, resulting in poor heat dissipation performance of electronic equipment and affecting the performance of the whole machine. Contents of the invention [0003] The present application provides a casing to solve the technical problem of poor heat dissipation performance of the casing in the prior art. [0004] In a first aspect, the present application provides a casing. The casing includes: a first support plate, a second support plate and a heat soaking plate. The first support plate, the heat soaking p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20336G06F1/1626G06F1/1656G06F1/203
Inventor 万伟舰罗永清陈金玉
Owner HONOR DEVICE CO LTD
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