Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Dispensing device capable of conveniently taking and placing flat integrated circuit chips

A technology of integrated circuits and dispensing devices, which is applied in the field of dispensing devices for flat integrated circuit chips that are easy to pick and place, can solve the problems of low product qualification rate, affecting chip heat dissipation and service life, increasing use costs, etc., and achieve the goal of reducing troubles Effect

Active Publication Date: 2021-12-24
贝尔智慧电子科技有限公司
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004]In order to overcome the disadvantages of offsetting the dispensing position of the dispensing machine, resulting in a low pass rate of the product, affecting the subsequent heat dissipation and service life of the chip, and increasing the cost of use , the technical problem of the present invention is: provide a kind of dispensing device that is convenient to pick and place flat integrated circuit chip with high qualified rate and reduced use cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Dispensing device capable of conveniently taking and placing flat integrated circuit chips
  • Dispensing device capable of conveniently taking and placing flat integrated circuit chips
  • Dispensing device capable of conveniently taking and placing flat integrated circuit chips

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A kind of glue dispensing device for taking and placing flat integrated circuit chips, such as Figure 1-2 As shown, it includes a first connection frame 1, a first connection rod 2, a first material receiving plate 3, a driving mechanism 4 and a material receiving mechanism 5, and the lower part of the front side of the first connection frame 1 has a discharge port, and the first connection The middle part of the frame 1 is provided with the first connecting rod 2 symmetrically front and back, and the first connecting rod 2 is symmetrically slid left and right to be provided with the first material receiving plate 3, and the first material receiving plate 3 is used to place chips to avoid glue dispensing When the chip slides, the chip can be placed right at the same time to play the role of positioning. The first material receiving plate 3 is provided with a driving mechanism 4, and the inner lower side of the first connecting frame 1 is provided with a material receivi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a dispensing device, in particular to a dispensing device capable of conveniently taking and placing flat integrated circuit chips. The technical problem is how to provide the dispensing device capable of conveniently taking and placing flat integrated circuit chips, high in qualified rate and capable of reducing use cost. According to the technical scheme, the dispensing device capable of conveniently taking and placing flat integrated circuit chips comprises a first connecting frame, first connecting rods, first material receiving plates, a driving mechanism and the like, a discharging opening is formed in the lower portion of the front side of the first connecting frame, the first connecting rods are arranged in the middle in the first connecting frame in front-back symmetry, the first material receiving plates are arranged between the first connecting rods in a left-right symmetrical sliding manner, and the driving mechanism is arranged on the first material receiving plates. The first material receiving plates move inwards to clamp chips, the chips are prevented from being prone to sliding during dispensing, meanwhile, the chips can be straightened, a positioning effect is achieved, and people can accurately find the dispensing positions when carrying out dispensing on the chips.

Description

technical field [0001] The invention relates to a glue dispensing device, in particular to a glue dispensing device for taking and placing flat integrated circuit chips. Background technique [0002] Before the chip is used, a plastic cover plate needs to be glued on the top to protect the crystal grains inside the chip from being scratched or damaged by high temperature. At present, when dispensing in the prior art, the dispensing is realized by moving the dispensing gun. In the process of dispensing, the chip is placed and fixed manually, and the position of the chip often shifts during the dispensing process. In turn, the dispensing position of the mobile dispensing gun is shifted, resulting in a low pass rate of the product, affecting the subsequent heat dissipation and service life of the chip, and increasing the cost of use. [0003] Therefore, in view of the above-mentioned problems, a glue dispensing device for taking and placing flat integrated circuit chips is pro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B05C13/02B05C5/02B05C11/00
CPCB05C13/02B05C5/02B05C11/00
Inventor 曾宪海
Owner 贝尔智慧电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com