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Device for small saw of machining center to adapt to plate thickness

A processing center and self-adaptive technology, which is applied in the direction of sawing machine, metal processing equipment, manufacturing tools, etc., can solve the problems of inconvenient adjustment and low processing efficiency

Pending Publication Date: 2021-12-10
CHENGDU HONGLIN MACHINERY
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The traditional cutting structure of the saw blade in the machining center requires manual adjustment of the height of the small saw when encountering different plate thicknesses when the small saw is scribing the line. Manual adjustment has the disadvantages of inconvenient adjustment and low processing efficiency.

Method used

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  • Device for small saw of machining center to adapt to plate thickness
  • Device for small saw of machining center to adapt to plate thickness

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no. 1 example

[0023] See figure 1 with figure 2 , this embodiment provides a small saw adaptive board thickness device in a machining center, which includes: a cylinder assembly 100, a slide assembly 200, a slide assembly 300, a small saw assembly 400 and an adaptive assembly 500, the slide assembly 300 is installed on the slide On the assembly 200, the top of the slide assembly 300 is connected to the cylinder assembly 100, the bottom of the slide assembly 300 is connected to the small saw assembly 400, the bottom of the small saw assembly 400 is connected to the self-adaptive assembly 500, and the adaptive assembly 500 is in contact with the board to drive the slide assembly 300 and The small saw assembly 400 on the slide assembly 300 is adjusted in height, and the cylinder assembly 100 is used to drive the slide assembly 200, and the slide assembly 300, small saw assembly 400 and adaptive assembly 500 on the slide assembly 200 to move up and down; The bottom of the saw assembly 400 is ...

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Abstract

The invention provides a device for a small saw of a machining center to adapt to the plate thickness. According to the device, a fixed relative distance can be kept between a saw blade of the small saw and a pressing roller, the distance is also the depth size of a lineation line of the small saw, plates of different thicknesses make direct contact with a rolling wheel, the plates can directly lift the small saw to the needed height, and therefore the purpose of automatically adapting to different plates is achieved. The device comprises an air cylinder component, a sliding seat component, a sliding plate component, a small saw component and a self-adaption component, wherein the sliding plate component is installed on the sliding seat component; the top of the sliding plate component is connected with the air cylinder component; the bottom of the sliding plate component is connected with the small saw component; the bottom of the small saw component is connected with the self-adaption component; and the self-adaption component makes contact with the plate to drive the small saw component to conduct height adjustment.

Description

technical field [0001] The invention relates to the field of plate processing centers, in particular to a small saw adaptive plate thickness device for a processing center. Background technique [0002] The saw blade cutting structure of the traditional machining center requires manual adjustment of the height of the small saw when encountering different plate thicknesses when the small saw is scribing. Manual adjustment has the disadvantages of inconvenient adjustment and low processing efficiency. Contents of the invention [0003] The purpose of the present invention is to provide a small saw self-adaptive board thickness device in the machining center, which can maintain a fixed relative distance between the small saw blade and the pressure roller, and the size of this distance is also the depth dimension of the small saw line, through different The thickness of the plate is in direct contact with the roller, and the plate can directly lift the small saw to the require...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23D47/02
CPCB23D47/02
Inventor 鲁广成黄锐曾忠秀
Owner CHENGDU HONGLIN MACHINERY
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