Miniature rapid cooling device based on porous water-drop-shaped Kagome structures

Abstract

A miniature rapid cooling device based on porous water-drop-shaped Kagome structures comprises a heat exchange box body structure; an upper baffle and a lower baffle are arranged in the heat exchange box body structure; an upper cooling cavity is formed between the heat exchange box body structure and the upper baffle; a lower cooling cavity is formed between the heat exchange box body structure and the lower baffle; a heat flow channel is formed between the upper baffle and the lower baffle; the porous hollow water-drop-shaped Kagome structures which are arranged in a staggered array mode are arranged in the heat flow channel; hollow cooling pipes of the same structure are arranged in the porous hollow water-drop-shaped Kagome structures; and the upper cooling cavity communicates with the lower cooling cavity through the hollow cooling pipes. The miniature rapid cooling device has good mechanical properties, is small in size, is convenient to prepare, and is detachable; and meanwhile, the arrangement mode of the water-drop-shaped Kagome structures can be adjusted or the quantity of lattice truss structures can be increased or decreased according to actual needs, and then uniform, rapid and efficient cooling is achieved.

Description

technical field [0001] The invention belongs to the technical field of heat exchangers, in particular to a miniature rapid cooling device based on a porous drop-shaped Kagome structure. Background technique [0002] Heat exchangers are important equipment for exchanging heat between hot and cold fluids, and are widely used in chemical industry, energy, power, metallurgy, machinery, aerospace and many other industrial equipment. With the development of 3D printing technology and the emergence of new materials, the complex internal structure of micro heat exchangers has greater and more free design space. There is a huge application potential in the rapid cooling of micro precision instruments. [0003] As the heat load of micro precision instruments and equipment such as chips and chassis continues to increase, it is difficult for ordinary heat exchange structures in common heat exchangers to match their technical requirements; at the same time, some new heat exchange struct...

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Problems solved by technology

[0003] As the heat load of micro precision instruments and equipment such as chips and chassis continues to increase, it is difficult for ordinary heat exchange structures in common heat exchangers to match their technical requirements; at the same time, some new heat exchange structures have problems of large volume and complicated preparation , slow heat transfer speed, low heat transfer efficiency, etc.

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