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Packaging structure, printed circuit board and electronic equipment

A technology of packaging structure and electronic components, applied in the direction of printed circuit, printed circuit, printed circuit components, etc., can solve the problems of impedance discontinuity, achieve the effect of improving impedance continuity, increasing impedance, and improving signal transmission effect

Pending Publication Date: 2021-11-23
ZHEJIANG UNIVIEW TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention provides a packaging structure, which solves the problem of discontinuous impedance of high-speed links at pads, can realize quantitative control of pad impedance, and improves signal transmission effect

Method used

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  • Packaging structure, printed circuit board and electronic equipment
  • Packaging structure, printed circuit board and electronic equipment
  • Packaging structure, printed circuit board and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] The pad assembly provided by Embodiment 1 of the present invention includes a conductive body in a strip structure.

[0042] Optionally, as in image 3 As shown, the conductive body 302 has a strip-shaped structure, and the extension direction of the conductive body 302 is parallel to the extension direction of the signal line 140; in the direction X parallel to the extension direction of the signal line 140, the length L10 of the conductive body 302 is greater than or equal to the length L10 of the pad body 301 The length L20.

[0043] In this example, if image 3 As shown, the extension direction parallel to the signal line 140 is defined as the X direction, and the direction perpendicular to the signal line 140 is the Y direction. In the Y direction, the extension direction of the conductive body 302 is parallel to the X direction, and the pad body 301 has a rectangular structure. , the signal line 140 is connected to a vertex of the pad body 301 , and the edge of ...

Embodiment 2

[0046] The pad assembly provided by Embodiment 2 of the present invention includes a conductive body in a semi-enclosed structure.

[0047] Optionally, as in figure 2 and 4 As shown, the conductive body 302 has a semi-enclosed structure, and the conductive body 302 has a first conductive portion 3021 parallel to the extending direction X of the signal line 140 and a second conductive portion 3022 perpendicular to the extending direction of the signal line 140; In the X direction of the extension direction of the signal line 140, the length L10 of the conductive body 302 is greater than or equal to the length L20 of the pad body 301; A distance threshold is set, wherein the minimum distance L30 between the conductive body 302 and the signal line 140 is the distance between the second conductive portion 3022 and the signal line 140 .

[0048] Specifically, such as figure 2 and 4 As shown, the extension direction parallel to the signal line 140 is defined as the X direction...

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Abstract

The invention discloses a packaging structure, a printed circuit board and electronic equipment. The packaging structure comprises a substrate, an electronic element and a bonding pad assembly, wherein the bonding pad assembly comprises a bonding pad body and a conductive body, the conductive body is arranged on the periphery of the bonding pad body, and the impedance of the bonding pad assembly is equal to preset impedance Z0; the electronic element is electrically connected with the bonding pad body, and the bonding pad body is connected with a signal line; the substrate comprises a conductive layer and a dielectric layer, the dielectric layer comprises a first dielectric layer, and the conductive layer comprises a first conductive layer; the bonding pad assembly and the signal line are arranged on the outer surface of the first dielectric layer, the first conductive layer is arranged on the side, which is away from the bonding pad assembly, of the first dielectric layer, the first dielectric layer is provided with a through hole, a conductive film is arranged on the inner surface of the through hole, and the conductive body is connected with the first conductive layer through the conductive film; and the conductive layer is provided with an opening structure, and the orthographic projection of the bonding pad body on the conductive layer is located in the opening structure. The packaging structure provided by the invention is beneficial to improving impedance continuity and improving a signal transmission effect.

Description

technical field [0001] The invention relates to the technical field of electronic devices, in particular to a packaging structure, a printed circuit board and electronic equipment. Background technique [0002] In a high-speed serial link system, in order to increase the noise tolerance of the circuit, it is usually necessary to connect AC coupling capacitors at the signal input and signal output terminals, so as to improve the anti-interference ability of high-speed signals. [0003] In a high-speed link, the impedance of the signal transmission path is negatively correlated with the width of the signal line. The larger the width of the signal line, the smaller the impedance of the signal transmission path. However, the width of the packaging pad of the AC coupling capacitor is much larger than the width of the signal line. Therefore, the impedance of the pad is smaller than the impedance of the signal line, which leads to the problem of discontinuous impedance at the pad o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11
CPCH05K1/025H05K1/111H05K1/112H05K2201/0776H05K2201/09372
Inventor 叶峰虞程华
Owner ZHEJIANG UNIVIEW TECH CO LTD
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