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Electronic equipment

A technology for electronic equipment and circuit boards, applied in the field of electronic equipment, can solve the problems of easy deformation of the casing and thick electronic equipment, and achieve the effect of relatively thick stacking, small stacking thickness and compact structure

Active Publication Date: 2021-11-19
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention discloses an electronic device, which can solve the problems that the casing of the electronic device is easily deformed and the electronic device is relatively thick

Method used

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Embodiment Construction

[0031] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts all belong to the protection scope of the present invention.

[0032] The technical solutions disclosed by various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0033] Please refer to Figure 1 to Figure 7 , the embodiment of the present invention discloses an electronic device, and the disclosed electronic device includes a first housing 100, a te...

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Abstract

The invention discloses electronic equipment. The electronic equipment comprises a first shell (100) which is provided with a through hole, a temperature sensor module (200) which is arranged in the through hole and is provided with a first electric connection part (210) and afirst circuit board (300). The first circuit board (300) is provided with a second electric connection part (400), the second electric connection part (400) is electrically connected with the first electric connection part (210), and the temperature sensor module (200) is connected with the first shell (100) in an injection molding mode. According to the scheme, the problems that the shell structure of the electronic equipment is low in strength and the electronic equipment is thick can be solved.

Description

technical field [0001] The present invention relates to the technical field of communication equipment, in particular to an electronic equipment. Background technique [0002] With the rapid development of electronic equipment, the application of electronic equipment is becoming more and more extensive, such as mobile phones, tablet computers and other electronic equipment are playing more and more roles in people's work, life, entertainment and so on. [0003] In order to improve the convenience of users in body temperature detection, in related technologies, a body temperature sensor is combined with an electronic device, and the user can measure the body temperature through the electronic device. Since the user generally carries the electronic device with him, when the user needs to perform body temperature detection, The user only needs to use the electronic device to complete the temperature detection, which is convenient for the user to detect the body temperature, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01J5/00G01K13/00
CPCG01J5/00
Inventor 梁源标
Owner VIVO MOBILE COMM CO LTD
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