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Pumpkin heat resistance field identification method

An identification method and heat-resistant technology, applied in other database retrieval, fruit tree cultivation, clustering/classification of other databases, etc., can solve problems such as lack of data, formulation, unfavorable exchange of identification results, inconsistent identification period, etc., to achieve Effects with clear validity and reliable results

Pending Publication Date: 2021-11-12
NINGBO ACAD OF AGRI SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, phenotypic identification mostly uses descriptive language, without data and formulas. At the same time, the identification period is not uniform, which is not conducive to the exchange of identification results

Method used

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  • Pumpkin heat resistance field identification method
  • Pumpkin heat resistance field identification method
  • Pumpkin heat resistance field identification method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] The planting of embodiment 1 pumpkin

[0070] The above-mentioned 11 parts of Indian pumpkin seeds were germinated and sown, and 50 plants were sown for each part of the material, and two leaves and one heart were planted. Climbing cultivation, the width of the border is 3m, the height of the border is more than 25cm, the width of the furrow is about 60cm, and the distance between plants is 50-60cm. One month after planting, the plants enter the vine stage.

Embodiment 2

[0071] Example 2 Judgment of the wilting level of pumpkin leaves

[0072] Heat resistance identification was carried out in the stretching stage: the results are shown in Table 1.

[0073] Leaf margins rise normally ( figure 1 A) or flat leaves without wilting symptoms ( figure 1 B); is level 0;

[0074] Slight wilting of leaf margins ( figure 1 C) or slightly wilting on the side along the central vein of the leaves ( figure 1 D), the angle between the slightly wilted leaf surface and the flat leaf surface is between 150-180°; it is grade 1;

[0075] The leaves are slightly wilted along both sides of the central vein, and the angle between the wilted leaf surface and the flat leaf surface is between 150-180° ( figure 1 E) or the leaves are wilting along both sides of the central vein, and the angle between the wilted leaf surface part and the flat leaf surface part is between 120-150° ( figure 1 F); for level 2;

[0076] The leaves are wilted from 2 / 3 of the leaf edge t...

Embodiment 3

[0079] Embodiment 3 calculates the heat damage index of every strain

[0080] Calculate the heat damage index of each plant according to the formula, the formula is as follows:

[0081] The heat damage index of each plant=∑(the number of wilting leaves at each level×the value of the wilting level) / (the total number of leaves under investigation×the highest level value)×100.

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Abstract

The invention discloses a pumpkin heat resistance field identification method, and belongs to the technical field of crop stress tolerance identification. The pumpkin heat resistance field identification method comprises the steps that the heat damage index of each plant is judged by counting the wilting stage number and the wilting leaf number of pumpkin leaves in the vine stretching period, and the pumpkin heat resistance is determined. According to the pumpkin heat resistance field identification method, the wilting degree of a single plant is associated with all leaves of the plant, the evaluation result is digitized and formulated, the effectiveness of collected data is clear through variance analysis and multiple comparison functions of statistical software, and the result of evaluating the heat resistance characteristic is reliable.

Description

technical field [0001] The invention belongs to the technical field of crop stress tolerance identification, and in particular relates to a field identification method for heat resistance of pumpkins. Background technique [0002] Indian pumpkin is an important economic crop. It has sweet and fragrant flour, low temperature resistance and high yield. The area of ​​early-maturing cultivation in greenhouses is expanding year by year. However, the crop has poor high temperature tolerance and is difficult to survive summer. Breeding new varieties of heat-resistant Indian squash is a key link to improve the adaptability of Indian squash. Natural identification in the field can simulate the production environment to the greatest extent and evaluate the heat resistance of breeding materials. However, phenotypic identification mostly uses descriptive language, without data and formulas. At the same time, the identification period is not uniform, which is not conducive to the exchan...

Claims

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Application Information

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IPC IPC(8): A01G22/05G06F16/906
CPCA01G22/05G06F16/906
Inventor 宋慧古斌权黄芸萍
Owner NINGBO ACAD OF AGRI SCI
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