Lidless bga socket apparatus for testing semiconductor device

Abstract

The present invention relates to a BGA socket apparatus which is a lidless-type from which a cover, generally provided on the top part of a socket body in order for the loading / unloading operation of an IC, is removed, the BGA socket apparatus enabling the elimination of elements which may obstruct air flow during testing.

Description

technical field [0001] The invention relates to a BGA socket device for semiconductor device testing, in particular to a lidless type BGA socket device, which removes the upper part of the socket body which is usually arranged for IC loading and unloading operations. cover and be able to exclude elements that may impede air flow during the test. Background technique [0002] Generally, a socket for a semiconductor device (IC, Integrated Circuit) (hereinafter referred to as "IC") is provided on a test board (Test Board) or a degradation board (Burn-in Board), and through the I / O terminals formed on the board ( Input and output terminals) to input and output the power supply of the predetermined voltage required to drive the IC and the degradation chamber (Burn-in Chamber) of the electronic signal or its peripheral equipment, and other test devices for testing the characteristics of the IC are connected to each other, so as to be used in IC test system. [0003] Among genera...

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Problems solved by technology

[0016] 1. On the whole, a large number of components are required and are relatively complicated, so a large amount of assembly time is required and the cost is high;

[0017] 2. Due to the structure in which the IC is surrounded by the lead wire guide or the cover in the state where the IC is loaded, the air flow is not smooth, and the heat generated by the IC cannot be effectively dissipated to the surrounding area.

[0019] 4. The forced flow of air in the deteriorating chamber is hindered by the cover or lead wire guide that is a part of the socket itself, so the forced flow of air cannot be effectively transmitted to the surface of the IC, and it is difficult to maintain uniform temperature of the IC

[0020] 5. Since the contact or release of the clamping contact and the ball terminal is realized through the horizontal operation of the movable side terminal, the movable side terminal repeatedly undergoes elastic deformation, so repeated use will lead to a decrease in durability, so that the contact with the ball terminal drop in contact force

Particularly, according to the prior art BGA socket device, during the return process of the movable side terminal (refer to Figure 5 (c)), the operating force to return the slider to the initial position is generated by the elastic restoring force of the movable side terminal, so as the number of times of use of the movable side terminal increases, the fatigue (stress) of the movable side terminal makes the elasticity The restoring force gradually decreases, and the contact force between the movable side terminal and the ball terminal weakens, which will lead to a decrease in the reliability of IC testing

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