Headband structure and headphone

A headband and earphone technology, applied in the field of headband structure, can solve the problems of poor user experience of the headband pad, and achieve the effect of improving the poor user experience

Pending Publication Date: 2021-11-05
SHENZHEN GRANDSUN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a headband structure and a headphone, aiming at solving the problem that the non-detachable structure design of the headband structure in the prior art cannot clean or replace the dirty headband cushion Technical issues with poor user experience

Method used

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  • Headband structure and headphone
  • Headband structure and headphone
  • Headband structure and headphone

Examples

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Embodiment Construction

[0029] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. Attached below by reference Figure 1~5 The described embodiments are exemplary, and are intended to explain the embodiments of the present invention, and should not be construed as limitations of the present invention.

[0030] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical ", "horizontal", "top", "bottom", "inner", "outer" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying Describes, bu...

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PUM

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Abstract

The invention belongs to the technical field of headphones, and particularly relates to a headband structure and a headphone. The headband structure comprises a headband, an upper cover and a headband pad, the headband pad is arranged below the headband, the headband is buckled to the two opposite sides of the width direction of the headband, the upper cover is arranged above the headband, and the upper cover is buckled to the position, corresponding to the headband pad, of the headband. According to the headband structure provided by the embodiment of the invention, the headband pad is designed to be of a detachable structure, that is, the headband pad buckled with the headband pad can be taken down relative to the headband, so that a user can freely disassemble and clean the headband pad and replace the headband pad with other color appearance matching, and then the headband pad with stains can be cleaned or replaced; and the use experience of a user on the earphone with the headband structure is improved.

Description

technical field [0001] The invention belongs to the technical field of headband structures, and in particular relates to a headband structure and earphones. Background technique [0002] Half of the headset includes a headband structure, and the headband structure generally includes a steel band and a headband pad. The headband structure in the prior art is generally a non-removable and replaceable structure integrated with the steel belt, wherein the outermost layer of the headband cushion is wrapped with a leather material. However, since the headband cushion often contacts with human hair It will produce stains such as oil and sweat, and as the use time prolongs, the user's experience will be greatly reduced. Contents of the invention [0003] The purpose of the present invention is to provide a headband structure and a headphone, aiming at solving the problem that the non-detachable structure design of the headband structure in the prior art cannot clean or replace th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/10H04R1/12
CPCH04R1/1008H04R1/12
Inventor 张传奇余新吴海全彭久高
Owner SHENZHEN GRANDSUN ELECTRONICS
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