Semiconductor machining equipment

Abstract

The invention provides semiconductor machining equipment. The semiconductor machining equipment comprises a supporting frame, a supporting bottom plate, side plates, a transmission mechanism used for transmitting a semiconductor substrate and a multi-side drying mechanism used for drying the semiconductor substrate, wherein the bottom of the supporting frame is fixedly connected with the supporting bottom plate; and the two side plates which are symmetrically distributed with the center line of the supporting frame as a symmetric line are fixedly connected to the upper surface of the supporting frame. The invention relates to the field of semiconductor machining. According to the semiconductor machining equipment, the problems of low process coherence, incomplete drying and low efficiency in an existing semiconductor machining process are solved, and a special structure for realizing multi-surface and multi-roll-shaft synchronous work, dry flow and wet flow division transmission and multi-aspect drying is designed; and therefore, the problems that a semiconductor substrate cannot be simply adjusted by a common drying device, the semiconductor substrate needs more procedures to be distributed and collected during drying, and the semiconductor substrate is complex in integration and non-uniform in drying, so that the drying efficiency is influenced to a certain extent, are effectively solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to semiconductor processing equipment. Background technique [0002] With the development of society, semiconductors are used more and more widely. The conductivity of semiconductors is between metal conductors and insulators. Semiconductors need to be cleaned during processing. After cleaning, in order to quickly enter the process and continue processing, it is necessary to clean them. For drying treatment, the current drying of semiconductors is mainly carried out by ordinary drying boxes, but the size of semiconductor substrates is getting smaller and smaller, and a large number of semiconductor substrates are piled up. If the substrates are placed inside the drying box for drying To dry, careful arrangement is required to disperse the substrates as much as possible, otherwise it will easily lead to uneven drying, and when drying, the semiconductor substrates can...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a semiconductor processing equipment, which solves the problem that it is difficult for a general drying device to adjust the semiconductor substrate by itself. The drying of the semiconductor substrate requires more processes for distribution and collection, and the integration of the semiconductor substrate is complicated. , uneven drying, which affects the drying efficiency to a certain extent

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