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Visual inspection equipment for semiconductor module packaging

A technology for module packaging and visual inspection, applied in semiconductor/solid-state device manufacturing, cleaning methods using gas flow, photogrammetry/videogrammetry, etc., can solve problems such as low practicability, semiconductor module movement, and low convenience , to achieve the effect of improving practicability, improving convenience, and avoiding the phenomenon of movement.

Active Publication Date: 2021-09-03
SHENZHEN BOYANG INTELLIGENT EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a visual inspection device for semiconductor module packaging, to solve the problems of low convenience, low practicability, and movement of semiconductor modules in the above-mentioned background technology.

Method used

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  • Visual inspection equipment for semiconductor module packaging
  • Visual inspection equipment for semiconductor module packaging
  • Visual inspection equipment for semiconductor module packaging

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. In addition , the terms "first", "second", "third", "upper, lower, left, right", etc. are used for descriptive purposes only and should not be construed as indicating or implying relative importance. At the same time, in the description of the present invention, unless otherwise clearly stipulated and limited, the terms "connected" and "connected" should be interpreted in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary. Based on the embodiments of the p...

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Abstract

The invention relates to the technical field of semiconductor modules, in particular to visual inspection equipment for semiconductor module packaging, which comprises a base. Cameras are arranged on both sides of the surface of the base, a control row key is fixed on the surface of one side of the base, a fixed cylinder is fixed in the center of the surface of the base, and a hinge column is hinged to the surface of the fixed cylinder. And an operation table is arranged above the fixed cylinder, the center position of the bottom of the operation table is fixedly connected with the surface of the hinge column, an adjusting mechanism is arranged on the surface of the base, a fixing mechanism is arranged on the surface of the operation table, and a self-locking mechanism is arranged in the fixing cylinder. The convenience degree of the visual inspection equipment in use is improved, the practicability of the visual inspection equipment in use is improved, and the phenomenon of movement of the semiconductor module in use of the visual inspection equipment is avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductor modules, in particular to visual inspection equipment for semiconductor module packaging. Background technique [0002] Visual inspection is to use machines instead of human eyes for measurement and judgment. Visual inspection refers to converting the ingested target into an image signal through machine vision products, and sending it to a dedicated image processing system. According to pixel distribution, brightness, color and other information, transform The image system performs various calculations on these signals to extract the characteristics of the target, and then controls the on-site equipment actions according to the results of the discrimination. [0003] There are many types of visual inspection equipment on the market today, which can basically meet people's needs, but there are still some problems: First, the visual inspection equipment is generally more cumbersome when adjust...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01C11/00H01L21/683H04N5/232H04N7/18B08B5/02
CPCG01C11/00H01L21/6838H04N7/181B08B5/02H04N23/695Y02E10/50
Inventor 刘冲刘丹刘国太
Owner SHENZHEN BOYANG INTELLIGENT EQUIP CO LTD
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