Photosensitive resin composition

Abstract

The purpose of the present invention is to provide a resin composition that exhibits a high storage stability in single-package form and that exhibits excellent properties and electrical characteristics for the cured product therefrom. Namely, provided are a resin composition comprising (A) a photobase generator comprising a compound represented by formula (1) (In formula (1), R1, R2, R3, R5, and R6 each independently represent, e.g., a hydrogen atom, hydroxyl group, alkoxy group, or organic group other than the preceding substituents. At least one of R4 represents an organic group that contains a thioether bond, and the other represents a hydrogen atom or an organic group that contains a thioether bond. The A represents a substituent represented by formula (1-1) or (1-2) (In formula (1-1), R7 and R8 each independently represent, e.g., a hydrogen atom, alkyl group, or heterocyclic group. In formula (1-2), R9 and R10 each independently represent an amino group or a substituted amino group.)), (B) an alkali-developable resin, and (C) a thermally reactive compound.

Description

technical field [0001] The present invention relates to a photopolymerization initiator containing a specific structure, an alkali-developable resin composition capable of forming a pattern by development, a dry film composed of the resin composition, a cured product of the resin composition, and a cured product having the same printed wiring boards. Background technique [0002] In recent years, as materials for solder resists for printed wiring boards and flexible printed wiring boards, an alkali-developing type photocurable resin composition using an alkaline aqueous solution as a developer has become mainstream in consideration of environmental problems. In such an alkali-developing type photocurable resin composition, an epoxy acrylate modified resin (hereinafter also simply referred to as epoxy acrylate) derived by modifying an epoxy resin is generally used. [0003] Solder resists using such photocurable resin compositions generally contain alkali-soluble epoxy acryl...

AI Technical Summary

Problems solved by technology

Hardeners that can be used in the liquefied epoxy resin composition include, for example, dicyandiamide and organic hydrazides, but since these hardeners are solid-dispersed hardeners, and by using these hardeners in epoxy resins Because of the insolubility of these potentials, it is necessary to uniformly disperse the hardener in the epoxy resin, and there is also a problem that it cannot be used in gap joints and sealing applications where the particle size of the hardener is narrower.

[0006] In addition, since the photocurable resin compositions containing thermosetting catalysts shown in Patent Documents 3 and 4 have poor storage stability in one liquid, and even at room temperature, the reaction proceeds little by little and the viscosity gradually decreases. Therefore, in actual use, it is necessary to mix the thermosetting catalyst before operation, and there is a problem of poor operation efficiency.

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