Warpage deformation prediction method for thin-walled components in space envelope forming

Abstract

The invention relates to a warping deformation prediction method for space envelope forming of thin-walled components. The method firstly determines the geometric size of the time-varying contact area between the envelope die and the blank in the space envelope form process, and calculates in a specific coordinate system The stress at any position in the contact area of ​​the billet, on this basis, calculate the stress at any position in the non-contact area of ​​the billet, construct the partial warpage balance differential equation in the non-contact area of ​​the billet, and solve the warpage balance differential equation in combination with the boundary conditions in the non-contact area of ​​the billet Equation, to obtain the warpage of thin-walled member space envelope forming. The invention can accurately predict the warping deformation of the space envelope forming of the high-performance thin-walled component, thereby improving the precision of the space envelope forming of the thin-walled component, and at the same time provide a basis for the optimized design of the process conditions of the space envelope forming of the thin-walled component.

Description

technical field [0001] The invention relates to the field of thin-wall component manufacturing, and more specifically, to a method for predicting warpage deformation of thin-wall component space envelope forming. Background technique [0002] Thin-walled components have the characteristics of light weight and large bearing capacity, and are widely used in aerospace fields such as wings, fuselages, and fuel storage tanks. At present, the main manufacturing method of thin-walled components is mechanical processing, but this method has problems such as poor performance, low processing efficiency, low material utilization rate, and high production cost. [0003] The space envelope forming method of thin-walled components is a new forming method for thin-walled components, which has the advantages of small forming load, high forming efficiency and excellent component performance. However, thin-walled components are small in thickness and large in diameter, and are prone to warpi...

AI Technical Summary

Problems solved by technology

However, thin-walled components are small in thickness and large in diameter, and are prone to warping deformation under the eccentric load of the space envelope forming envelope mold, which affects the precision of the component, and even causes the component to be folded, broken and scrapped. Accurate and efficient prediction of warping deformation is the realization of Prerequisites for Space Envelope Forming of High Performance Thin-Walled Components

At present, there is no report on the warpage deformation prediction method of thin-walled components space envelope forming

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