A kind of parylene F-type vapor deposition method

Abstract

The invention belongs to the technical field of Parylene F-type vapor deposition, and in particular relates to a Parylene F-type vapor deposition method; by optimizing and improving the evaporation process and the cracking process, the Parylene F-type raw material which is difficult to deposit can also obtain faster evaporation The film composition has excellent purity performance, and no changes have been made to the common Parylene vapor deposition equipment in China, which greatly improves the processing efficiency under the premise of ensuring the film performance. At the same time, due to the stable evaporation rate, the thickness of the final film layer can be controlled by controlling the process time, which reduces the difficulty of film thickness control and makes the reaction more controllable.

Description

technical field [0001] The invention belongs to the technical field of Parylene F type vapor deposition, in particular to a Parylene F type vapor deposition method. Background technique [0002] The Chinese name of Parylene is p-xylene dimer. Commonly used ones include unsubstituted Parylene N-type and its four derivatives Parylene C-type (dichloro-p-xylene dimer), Parylene D-type (tetrachloro-p-xylene dimer) ), Parylene F type (tetrafluoro-p-xylene dimer) and Parylene AF4 type (octafluoro-p-xylene dimer). The biggest difference between the five raw materials is the temperature resistance grade. Compared with Parylene C, the performance of Parylene D is less improved, and the deposition efficiency is low and the cost is high, so it is rarely used in the industry at present. Although Parylene AF4 can withstand temperatures up to 480°C, it is extremely difficult to synthesize. The global annual production volume is still less than 1000kg, so the price is extremely expensive,...

AI Technical Summary

Problems solved by technology

Compared with Parylene C type, the performance of Parylene D type is slightly improved, and the deposition efficiency is low and the cost is high, so it is rarely used in the industry at present.

Although Parylene AF4 can withstand a temperature of up to 480°C, it is extremely difficult to synthesize, and the global annual production is still less than 1000kg, so the price is extremely expensive, and considering the usage scenarios, there is a lot of performance waste, and it is generally not used except in very special scenarios. use

This technology realizes the gasification of Parylene F by controlling the temperature. The evaporation pressure is constantly changing, and the evaporation rate is unstable; can still not enough

[0007] Domestic current Parylene gas-phase deposition has fewer relevant technical standards (only SJ 20897 "parylene deposition process specification"), and does not provide clear suggestions on the process parameters of Parylene F type, etc., so the present invention intends to adopt Starting from the deposition principle and process of Parylene F type, improving its process parameters and improving processing efficiency under the premise of ensuring performance

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