A transfer member and its preparation method, transfer head

Abstract

The invention relates to a transfer member, a preparation method thereof, and a transfer head. The method includes disposing an elastic adhesive layer on the surface of the substrate, and disposing a mask plate including a hollow area on the elastic adhesive layer, and then etching the elastic adhesive layer through the mask plate. Compared with etching a sapphire substrate, etching the elastic adhesive layer Subbing is much easier. Moreover, as long as the elastic adhesive layer is thick enough, a transfer member with a higher aspect ratio can be etched, which can meet the transfer requirements of various devices. In addition, because the surface of the transfer member that adheres to the device to be transferred is not an etched surface, it has relatively high flatness, strong adhesion, and a good device transfer effect. Moreover, since mold turning is not involved in the preparation process, it is not necessary to face the problem of difficult demoulding. Therefore, the preparation method of the transfer member provided by the present application not only has a low preparation process difficulty, but also has a high quality transfer member, which meets the device transfer requirements, and is conducive to improving the efficiency and yield of mass transfer of devices.

Description

technical field [0001] The invention relates to the field of mass transfer, in particular to a transfer member, a preparation method thereof, and a transfer head. Background technique [0002] PDMS Stamp (polydimethylsiloxane stamp) is the main device used for mass transfer of micro-devices. At present, PDMS Stamp is mainly prepared by etching the substrate to form a mold with multiple grooves, and then aligning them in the mold. PDMS (Polydimethylsiloxane, polydimethylsiloxane) was injection-molded. After the PDMS in the mold is cured, the PDMS with multiple bumps, the PDMS Stamp with multiple bumps, is taken out by overturning the mold. [0003] Obviously, the quality of the PDMS Stamp prepared by this preparation scheme is directly related to the quality of the mold, but the substrate used to form the mold is usually a sapphire substrate, and the sapphire substrate is difficult to etch and the etching depth is small, which often leads to PDMS Stamps The aspect ratio is ...

AI Technical Summary

Problems solved by technology

[0005] In view of the deficiencies of the above-mentioned related technologies, the purpose of this application is to provide a transfer member and its preparation method, and a transfer head, aiming at solving the problem that the PDMS Stamp produced by the PDMS Stamp preparation scheme in the related art does not meet the device transfer requirements, and the device transfer effect bad question

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