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Composition and manufacturing method of special epoxy acrylic resin for ldi photoresist

A technology of epoxy acrylic and composition, which is applied in the field of circuit board production, can solve the problems of slow curing speed, insufficient photolithographic resolution, unfavorable rapid manufacturing, etc., and achieve the effect of convenient heating

Active Publication Date: 2021-10-08
深圳市德贝尔光电材料有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, photoresist is needed when LDI is used for imaging, and the existing photoresist needs to use the composition of epoxy acrylic resin, but the curing speed of the composition of epoxy acrylic resin is slow, and due to the large amount of shrinkage after curing, photolithography The resolution is not high enough, the integration of integrated circuits is low, and at the same time, the material mixing speed of the manufacturing device is low, which is not conducive to rapid manufacturing

Method used

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  • Composition and manufacturing method of special epoxy acrylic resin for ldi photoresist
  • Composition and manufacturing method of special epoxy acrylic resin for ldi photoresist
  • Composition and manufacturing method of special epoxy acrylic resin for ldi photoresist

Examples

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Effect test

Embodiment 1

[0044] Such as figure 1 Shown, a kind of composition of epoxy acrylic resin special for LDI photoresist, the composition of this special epoxy acrylic resin of LDI photoresist is made up of the composition of following parts by weight: Dicyclopentadienyloxyethyl acrylate 38 -48 parts, 15-25 parts of polyurethane modified epoxy acrylic resin, 0.5-0.7 parts of triaryl silicone ether, 0.01-0.05 parts of active sensitizer, 0.03-0.05 parts of benzoyl peroxide, acid diffusion inhibitor 0.02-0.05, 2-7 parts of acrylic free radical reactive diluent, 8-13 parts of propylene glycol ether.

[0045] A kind of manufacture method of the composition of epoxy acrylic resin special for LDI photoresist, manufacture method step is as follows:

[0046] Step 1: Mix dicyclopentadienyloxyethyl acrylate and polyurethane modified epoxy acrylic resin and add them to the reaction kettle, then add propylene glycol ether and triaryl siloxane, and heat the materials to 150-170°C under reflux , keep warm ...

Embodiment 2

[0051] Embodiment 2 is a further improvement to Embodiment 1.

[0052] Such as figure 2 , 3 , 4, 5, 6, 7, 8, 11 shows a kind of manufacturing device of the composition of LDI photoresist special-purpose epoxy acrylic resin, comprises reaction kettle 1, cover plate 2, feed pipe 4, dropper 5 And the third discharge pipe 7, the bottom of the reactor 1 is fixedly connected with the third discharge pipe 7, the top of the reactor 1 is fixedly connected with the cover plate 2, and the top of the cover plate 2 is connected with the stirring structure 3 and the feed pipe 4 And dropper 5, dropper 5 adds emulsion A in the reaction kettle 1, the top of feeding pipe 4 and the bottom of the third discharge pipe 7 are all screwed with caps, stirring structure 3 includes drive motor 301, rotating shaft 302, the first A bevel gear 303, a second bevel gear 304, a crankshaft 305, a stirring plate 306 and a scraper 307, the driving motor 301 is fixedly mounted on the top of the cover plate 2, ...

Embodiment 3

[0056] Embodiment 3 is a further improvement to Embodiment 1.

[0057] Such as figure 2 , 7, 8, 10 The side wall of the reactor 1 is connected with a sampling structure 9, and the sampling structure 9 includes a sampling cylinder 901, a threaded rod 902, a nut 903, a threaded sleeve 904, a sampling hole 905, a connecting bearing 906, a horizontal hole 907, and a sample groove 908, movable column 909, chute 910 and limit slider 911, horizontal hole 907 is fixedly installed on the side wall of reaction kettle 1, and sampling cylinder 901 is fixedly connected in horizontal hole 907, and the top middle end of sampling cylinder 901 is fixedly connected There is a sampling hole 905, the left end of the sampling cylinder 901 is fixedly connected with a threaded sleeve 904, the threaded sleeve 904 is threadedly connected with a threaded rod 902, the left end of the threaded rod 902 is fixedly connected with a nut 903, and the inner end of the threaded rod 902 is fixedly connected wi...

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Abstract

The invention discloses a composition and a manufacturing method of epoxy acrylic resin special for LDI photoresist, and relates to the technical field of circuit board production. The composition of epoxy acrylic resin special for LDI photoresist consists of the following ingredients in parts by weight: acrylic acid Dicyclopentadienyloxyethyl ester 38-48 parts, polyurethane modified epoxy acrylic resin 15-25 parts, triaryl silicone ether 0.5-0.7 parts, active sensitizer 0.01-0.05 parts, benzoyl peroxide 0.03-0.05 parts, 0.02-0.05 parts of acid diffusion inhibitor, 2-7 parts of acrylic free radical reactive diluent, 8-13 parts of propylene glycol ether, the composition of the special epoxy acrylic resin for LDI photoresist of the present invention has a fast curing speed, After curing, the shrinkage is small, the photolithography resolution is high, and the integration degree of integrated circuits is high.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a composition and a manufacturing method of epoxy acrylic resin special for LDI photoresists. Background technique [0002] LDI, the full name in English is laser direct imaging, and the full name in Chinese is laser direct imaging technology, which is used in the exposure process in the pcb process. It is different from the traditional film contact exposure method. Composition techniques. Such substrates can be used in the manufacture of semiconductor devices, various integrated circuits, flat panel displays (such as liquid crystal displays), circuit boards, biochips, micromechanical electronic chips, optoelectronic circuit chips, and the like. [0003] At present, photoresist is needed when LDI is used for imaging, and the existing photoresist needs to use the composition of epoxy acrylic resin, but the curing speed of the composition of epoxy acrylic resin is...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G03F7/027
CPCG03F7/004G03F7/027
Inventor 高付有
Owner 深圳市德贝尔光电材料有限公司
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