Soldering paste solderability testing device and method under simulated backflow temperature curve

Abstract

The invention relates to a soldering paste solderability testing device and method under a simulated backflow temperature curve, the device comprises a tin furnace, the tin furnace comprises a tin bath used for containing soldering paste and a heating core used for heating the tin bath, a temperature sensor is arranged in the tin bath, a metal hanging piece used for adsorbing the molten soldering paste is hung above the tin bath, the metal hanger is used for being inserted into a tin bath during weldability testing, the metal hanger is hung on a force sensor used for acquiring the wetting force of the metal hanger in the testing process, and the device further comprises a lifting platform used for adjusting the depth of the metal hanger inserted into the tin bath, a controller used for controlling the real-time temperature in the tin bath to change along with the simulated backflow temperature curve, collecting the real-time wetting force and controlling the lifting platform, the tin furnace is arranged on the lifting platform, and the heating core, the temperature sensor, the force sensor and the lifting platform are all connected to the microcontroller. Compared with the prior art, the method has the advantage of high test accuracy.

Description

technical field [0001] The invention relates to a solderability test device for solder paste, in particular to a test device and a test method for the solderability test of solder paste under the simulated reflow temperature curve. Background technique [0002] The reason why the electronics industry can develop rapidly is that the invention of Surface Mount Technology (SMT, Surface Mount Technology) has made a great contribution. And reflow soldering is one of the most important technologies in surface mount soldering technology. [0003] Reflow soldering (Reflow) is to remelt the solder paste pre-distributed on the printed board pad to realize the soldering of the mechanical and electrical connection between the solder end of the surface mount component or the pin and the printed board pad. Reflow soldering is to solder components to PCB boards, and reflow soldering is for surface mount devices. Reflow soldering is based on the action of hot air flow on solder joints. Th...

AI Technical Summary

Problems solved by technology

[0006] Therefore, the solderability of components, PCB, solder paste and a reasonable reflow temperature curve directly affect the quality and life of the product. To test these, a solderability tester is used. The solderability tester currently on the market For basic components, there is no separate test for solder paste. Even if there is, the measurement is started when the temperature of the reflow zone is reached, and the change of solderability of the measured object during the entire reflow process cannot be truly restored.

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