Wafer automatic needle aligning device and method

Abstract

The invention provides an automatic wafer alignment device and method. The automatic wafer alignment device comprises an image acquisition assembly, a movement assembly, a data processing assembly, a wafer tray used for carrying wafer to be aligned, and a probe card for alignment with the wafer to be aligned, wherein the image acquisition assembly consists of a camera of which the surface of a lens is provided with a cross wire mark, the movement assembly performs fixed-value movement through a grating ruler, the image acquisition assembly is used for acquiring images of the wafer tray, the probe card and the wafer to be subjected to probe alignment and transmitting the images to the data processing assembly; the data processing assembly is used for processing the received image data and calculating needle aligning parameters according to the data; the wafer tray is fixedly connected with the movement assembly, and the wafer tray is driven by the movement assembly to move. Wafer needle alignment is carried out through image recognition and grating ruler positioning, and needle alignment in the X direction, the Y direction and the Z direction can be completed at the same time; a calibration block is not used, so installation difficulty and needle alignment operation steps are reduced; the needle alignment method is simple, data processing is more accurate, and alignment precision and efficiency are improved.

Description

technical field [0001] The invention relates to the field of wafer processing, in particular to an automatic wafer alignment device and method. Background technique [0002] Wafer probe station is the equipment that supports the testing machine to test the performance and quality of each chip on the wafer in the front process of semiconductor chip manufacturing. It is an essential link to ensure the quality of chip manufacturing and reduce manufacturing costs and losses. After the wafer manufacturing is completed, it is necessary to enter the wafer testing stage. The wafer testing uses a testing machine to test each die on the chip through the combination of the probe station and the probe. The pad makes direct contact so that the testing machine can directly input or output signals to the chip, and its test parameters include the DC parameters and AC parameters of the chip. [0003] Existing wafer probe stations mostly use test alignment. The probe card is preliminarily ad...

AI Technical Summary

Problems solved by technology

The above-mentioned needle alignment method has the disadvantages of complicated operation and poor stability

[0004] In the invention patent number CN105486995B "Automatic Probe Station Image Positioning Device and Visual Alignment Method", a needle alignment device and method for precise needle alignment by means of calibration blocks are proposed, which can achieve higher precision needle alignment , but it involves too many formulas and too many calculations. In the calculation process, it is very easy to produce errors due to the manufacturing accuracy or installation accuracy of the calibration block, which will affect the needle alignment accuracy and reduce the needle alignment efficiency.

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