HP-X3 full-automatic lens chip mounter

A HP-X3, fully automatic technology, used in mechanical equipment, devices for coating liquid on surfaces, material gluing, etc., can solve problems such as inability to automatically change disks, low degree of automation, and position offset.

Active Publication Date: 2021-04-30
SHENZHEN BAOCHUANG ELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art, provide a HP-X3 automatic lens chip mounter, solve the problem in the prior art that there is only one-way identification, and the identification accuracy is not a...

Method used

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  • HP-X3 full-automatic lens chip mounter
  • HP-X3 full-automatic lens chip mounter
  • HP-X3 full-automatic lens chip mounter

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Embodiment Construction

[0032] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0033] Please refer to Figure 1-Figure 11 , the present invention provides a HP-X3 fully automatic lens chip mounter, comprising: a frame 1, a dispensing mechanism 2 arranged on the frame 1, a patch mechanism 3, an offset correction component 4, an automatic disk changer Mechanism 5, the swing arm assembly 6 arranged on the upper side of the automatic disk changing mechanism 5; the dispensing drive assembly 8 is arranged on one side of the glue dispensing mechanism 2, and the thimble assembly is arranged at the bottom of the automatic disk changing mechanism 5 7. The upper and lower sides of the offset correction component 4 are respectively provided with a first position detection device 10 and a second position detection device 11; the dispensing mechanism 2 is used to align the jig points on the jig carrier Glue; the dispensing drive ass...

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Abstract

The invention discloses an HP-X3 full-automatic lens chip mounter. The HP-X3 full-automatic lens chip mounter comprises a rack, a dispensing mechanism arranged on the rack, a chip mounting mechanism, a deviation correcting assembly, an automatic disc changing mechanism and a swing arm assembly, wherein the dispensing mechanism arranged on the rack, the chip mounting mechanism, the deviation correcting assembly, the automatic disc changing mechanism are arranged on the rack, the swing arm assembly is arranged on the upper side of the automatic disc changing mechanism, wherein a dispensing driving assembly is arranged on one side of the dispensing mechanism, an ejector pin assembly is arranged at the bottom of the automatic disc changing mechanism, and a first position detection device and a second position detection device are arranged on the upper side and the lower side of the deviation correcting assembly correspondingly. According to the HP-X3 full-automatic lens chip mounter, the first position detection device matches with the second position detection device, bidirectional positioning detection is achieved, the wafer position is adjusted through the deviation correcting assembly according to a positioning detection result, the feeding precision is effectively improved, and the mounting precision is guaranteed.

Description

technical field [0001] The invention relates to the field of mounting machines, in particular to an HP-X3 automatic lens chip mounting machine. Background technique [0002] The lens chip mounter in the prior art has the following problems: 1. It is only equipped with a bottom mirror camera for recognition, which can only perform one-way recognition, and the recognition accuracy is not accurate enough; 2. When the swing arm is feeding the material to the placement station, usually There is a position offset from the preset position, and a position correction device needs to be installed, but the position correction device installed in the prior art can only perform a small amount of correction, resulting in low feeding accuracy; 3. It is impossible to automatically change the crystal ring The low degree of automation reduces the production efficiency, and every time the disk is changed, it needs to be stopped, and the risk of collision and misoperation is high; 4. Usually on...

Claims

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Application Information

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IPC IPC(8): B05C5/02B05C13/02F16B11/00
CPCB05C5/0208B05C5/027B05C13/02F16B11/006
Inventor 刘方照陈大罗刘佳佳周鹏宇郑宇张星星
Owner SHENZHEN BAOCHUANG ELECTRONICS EQUIP CO LTD
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