Automatic assembling and feeding machine for heat conduction blocks

Abstract

The invention relates to an automatic assembling and feeding machine for heat conduction blocks. The automatic assembling and feeding machine comprises a rack, a rotary table mechanism, a copper sheet supply mechanism, an iron cover supply mechanism, a copper sheet taking manipulator, a solder paste printing mechanism, a solder paste detection mechanism, an iron cover taking manipulator, a feeding manipulator and a feeding conveying line, wherein the rotary table mechanism, the copper sheet supply mechanism, the iron cover supply mechanism, the copper sheet taking manipulator, the solder paste printing mechanism, the solder paste detection mechanism, the iron cover taking manipulator, the feeding manipulator and the feeding conveying line are arranged at the upper end of the rack; the copper sheet taking manipulator, the solder paste printing mechanism, the solder paste detection mechanism, the iron cover taking manipulator and the feeding manipulator are sequentially arranged around the rotary table mechanism, and five positioning jigs corresponding to the mechanisms are arranged on the rotary table mechanism; the copper sheet supply mechanism and the iron cover supply mechanism correspondingly supply materials for the copper sheet taking manipulator and the iron cover taking manipulator respectively; and the feeding manipulator is used for sucking the heat conduction blocks and conveying the heat conduction blocks to the feeding conveying line. The automatic assembling and feeding machine can be used for automatically assembling and feeding the heat conduction blocks, so that the production efficiency is improved, the labor intensity is alleviated, meanwhile, the assembling precision is high, and the solder paste printing thickness and printing shape are easy to control.

Description

technical field [0001] The invention relates to the field of heat dissipation module production, in particular to an automatic assembly and feeding machine for heat conduction blocks. Background technique [0002] Cooling modules are widely used in notebook computers to cool the CPU and GPU, such as figure 1 In the heat dissipation module shown, the heat conduction block 18 is fixed on the bottom of the heat conduction pipe 17 by solder paste; wherein the heat conduction block 18 includes an iron cover 181 for connecting the main board, and a heat dissipation copper sheet 182 fixed in the iron cover by solder paste; However, at present, the heat conduction blocks are assembled manually, and there are the following problems: 1. Several or even a dozen workers are required to assemble, which not only has low production efficiency, but also has high labor intensity, and the assembly accuracy is not easy to guarantee, resulting in a high defect rate, thus It greatly increases t...

AI Technical Summary

Problems solved by technology

[0002] Cooling modules are widely used in notebook computers to cool the CPU and GPU, such as figure 1 In the heat dissipation module shown, the heat conduction block 18 is fixed on the bottom of the heat conduction pipe 17 by solder paste; wherein the heat conduction block 18 includes an iron cover 181 for connecting the main board, and a heat dissipation copper sheet 182 fixed in the iron cover by solder paste; However, at present, the heat conduction blocks are assembled manually, and there are the following problems: 1. Several or even a dozen workers are required to assemble, which not only has low production efficiency, but also has high labor intensity, and the assembly accuracy is not easy to guarantee, resulting in a high defect rate, thus Greatly increase the production cost; 2. The thickness and shape of the solder paste are not easy to control, too much or too little will affect the heat dissipation efficiency

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