Low-impedance four-layer circuit board and manufacturing process thereof

Abstract

The invention discloses a low-impedance four-layer circuit board and a manufacturing process thereof. The low-impedance four-layer circuit board comprises a circuit board body, wherein a first mounting base and a second mounting base are clamped to the surface of the circuit board body, and a connecting frame clamped to the surface of the circuit board body is fixedly connected to one side of the first mounting base. The invention relates to the technical field of circuit boards. According to the low-impedance four-layer circuit board and the manufacturing process thereof, external fresh air filtered by a filter screen is conveyed into a filter box, then conveyed into an air blowing hopper through an air outlet pipeline and blown out through the air blowing hopper to clean the surface of the circuit board, wind blows the circuit board to blow away dust at the moment, the top of the circuit board is limited through upper limiting blocks arranged at the top at intervals, and the circuit board is conveyed by a conveying belt during cleaning, so that the circuit board can be prevented from being blown away by strong wind, and the cleanness of the surface of the circuit board can be ensured to facilitate subsequent electroplating processing.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a low-impedance four-layer circuit board and a manufacturing process thereof. Background technique [0002] PCB circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. The main advantage of using circuit boards is that they greatly reduce wiring and assembly errors, and improve automation levels and production labor rates. There are various specifications of PCB circuit boards on the market, but PCB circuit boards usually have a cleaning process before electroplating. This is because human contact or other inevitable external factors will cause contamination on the surface of the circuit board. The surface cleaning is not thorough, and in the presence of pollutants, the electroplating cannot be applied to the partially polluted areas, or the electroplating is easy to fall off due to the influence of temperatu...

AI Technical Summary

Problems solved by technology

[0003] Aiming at the deficiencies of the prior art, the present invention provides a low-impedance four-layer circuit board and its manufacturing process, which solves the problem of time-consuming and labor-intensive and inefficient manual cleaning of the surface of the circuit board to be electroplated, and the manual contact guarantee during the cleaning process The cleanliness of the surface will not be affected, which will have a great impact on the quality of subsequent electroplating.

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