An etching clamping device for promoting metal etching and separating invalid particles

Abstract

The invention relates to the technical field of computer hardware and software, and discloses an etching clamping device that promotes metal etching and separates invalid particles, including a transmission shaft, the surface of the transmission shaft is fixedly connected with a mounting frame, and the inside of the mounting frame slides A slide bar is connected, the end of the slide bar is fixedly connected with a metal contact, the side of the metal contact is slidably connected with a resistance strip, the inside of the mounting frame is fixedly connected with an electromagnetic rod, and the surrounding of the mounting frame Fixedly connected with a rotating shaft. When the mounting frame is rotated, the stirring rod is conically stirred, so that the centrifugal force of the solution at the upper end is greater, and the centrifugal force of the solution at the lower end is smaller, so that metal ions can accumulate in the center of the lower end, and impurities with lighter weight can float around the upper end of the solution. , when the mounting frame does not rotate, the stirring rod can return to its original shape, thereby achieving the effect of separating invalid particles and making the ions participating in the reaction have a higher purity.

Description

technical field [0001] The invention relates to the technical field of computer software and hardware, in particular to an etching clamping device for promoting metal etching and separating invalid particles. Background technique [0002] In the software and hardware of the computer, the main board can provide power supply for various hardware and software, so that the computer equipment can operate normally. In the manufacturing process of the main board, after the circuit layout is designed, it is necessary to etch the copper on the surface of the circuit. However, the current etching device cannot automatically clamp it, and manual clamping is required, and the angle of impurity ions inside the solution affects the etching work of the main board. [0003] In order to solve the above problems, the inventor provides an etching clamping device that promotes metal etching and separates invalid particles. When the mounting frame is rotated, the stirring rod is conically stirre...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies in the prior art, the present invention provides an etching clamping device that promotes metal etching and separates invalid particles, which can be automatically fixed when the main board is placed on the surface of the receiving plate, and can heat the solution around the main board so that The metal ions around the main board are relatively active, the chemical reaction is more efficient, and it can separate invalid particles and make the ions participating in the reaction have a higher purity. This solves the problem that the current etching device cannot automatically clamp it and needs manual clamping. and the angle of impurity ions inside the solution affects the etching work of the motherboard

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