Middle frame of electronic product and manufacturing method thereof, casing of electronic product and electronic product
A technology for electronic products and production methods, which is applied to electrical equipment shells/cabinets/drawers, electrical components, chassis/boxes/drawer parts, etc., can solve the problem of low color brightness, no ceramic white color effect, and inability to achieve Ceramic white and other problems, to achieve high brightness, brilliant effect, and improve the effect of overall brightness
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preparation example Construction
[0052] The preparation process of the first UV adhesive layer 140 includes: the pre-baking temperature is 50°C-60°C, the pre-baking time is 3min-5min; the humidity of the spray booth is 45%-70%, and the temperature of the spray booth is 18-25°C; UV The irradiation energy of the furnace is 900mj / cm 2 ~1200mj / cm 2 . The above only lists a preparation process of a commonly used UV glue layer, but is not limited to this, and can also be a preparation process of a UV glue layer commonly used in the art.
[0053] Further, the thickness of the first UV adhesive layer 140 is 8 μm˜12 μm. In one embodiment, the thickness of the first UV adhesive layer 140 is 8 μm, 9 μm, 10 μm, 11 μm or 12 μm.
[0054] The function of the second UV adhesive layer 150 is mainly to protect the optical film layer 130 and at the same time improve the overall wear resistance of the middle frame 100 of the electronic product. The composition and preparation process of the second UV adhesive layer 150 are t...
Embodiment 1
[0091] The manufacturing process of the middle frame of the electronic product of the present embodiment is as follows:
[0092] (1) A coating layer with a thickness of 15 μm is formed by spraying on the substrate. Wherein, the raw material of the coating layer is composed of a coating main agent with a mass ratio of 1:3 and 783 slow-drying water (thinner). In parts by mass, the coating main agent is composed of 20 parts of ABS resin, 30 parts of titanium dioxide (white pigment), 30 parts of 783 slow-drying water (solvent) and 2 parts of dispersant (auxiliary).
[0093] (2) A first UV adhesive layer with a thickness of 10 μm is formed on the side of the coating layer away from the substrate. The raw material of the first UV adhesive layer is composed of photoinitiator, auxiliary agent and 783 slow drying water (diluent).
[0094] (3) forming a first high refractive index layer, a first low refractive index layer and a second high refractive index layer by sputtering in seque...
Embodiment 2
[0097] The manufacturing process of the middle frame of the electronic product of Example 2 is similar to the manufacturing process of the middle frame of the electronic product of Example 1, except that the material and thickness of the optical thin film layer are different. In the optical thin film layer of Example 2, the material of the first high refractive index layer is TiO 2 , the thickness is 21nm, the material of the first low refractive index layer is SiO 2 , with a thickness of 28 nm. The material of the second high refractive index layer is TiO 2 , with a thickness of 39 nm.
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