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Laminating equipment

A technology for laminating equipment and platforms, applied in mechanical equipment, material gluing, connecting components, etc., can solve the problems of low production efficiency and low qualification rate

Active Publication Date: 2021-03-12
深圳市昆龙卓盈机电有限公司
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AI Technical Summary

Problems solved by technology

[0003] Aiming at the deficiencies of the existing technology, the present invention proposes a laminating equipment, which aims to solve the problems that most of the lamination of bipolar plates and sealing rings is manual operation, low production efficiency and low pass rate

Method used

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Embodiment Construction

[0029] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0030] like Figure 1 to Figure 8 As shown, the embodiment of the present invention proposes a bonding equipment, including a first frame 1, a first transmission mechanism 2, a first loading platform 3, a second transmission mechanism 4, a second loading platform 5a, and a third loading platform 5b , base 61, joint robot 62, first adsorption device 8 and film tearing mechanism 9;

[0031] The first transmission mechanism 2 and the second transmission mechanism 4 are respectively arranged on the first frame 1, the first loading platform 3 is arranged on the first transmission mechanism 2, the first...

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Abstract

The invention relates to the technical field of bipolar plate assembly, in particular to laminating equipment. A joint robot drives a first adsorption device to adsorb a sealing ring, then moves the sealing ring to a film tearing mechanism to tear off a protective film, then moves the sealing ring to an attaching station, installs the sealing ring into a sealing groove of a bipolar plate and attaches the sealing ring to the bipolar plate through gum, and the problems that most bipolar plates and sealing rings are attached through manual operation, the production efficiency is low and the percent of pass is low are solved.

Description

technical field [0001] The invention relates to the technical field of bipolar plate assembly, in particular to a bonding device. Background technique [0002] At present, most of the bipolar plate and the sealing ring are bonded manually. The user must first tear off the protective film of the sealing ring, and then install the sealing ring in the sealing groove of the bipolar plate for bonding. The production efficiency is low, and the error rate of the lamination is high, resulting in a low pass rate of the product. Contents of the invention [0003] Aiming at the deficiencies of the prior art, the present invention proposes a laminating equipment, aiming at solving the problems that most lamination of bipolar plates and sealing rings is manual operation, low production efficiency and low qualified rate. [0004] The technical scheme that the present invention proposes is: [0005] A bonding equipment, comprising a first frame, a first transmission mechanism, a first ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/91B65B69/00F16B11/00
CPCB65G47/91B65B69/0025F16B11/006
Inventor 龙翔邓亮沈蛟
Owner 深圳市昆龙卓盈机电有限公司
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