Method and apparatus for transfer of two-dimensional materials

Abstract

Aspects of the disclosure include systems and methods for removing a sample from a carrier material and depositing the sample onto a substrate. The sample can be placed in an aperture of a substrate guide on a stage within a cavity. Etching fluid can be introduced into the cavity to etch the carrier material from the sample and then drained. A rinsing material can be introduced into the cavity torinse the etching fluid and then drained. A sample deposition process can be performed, wherein rinsing fluid is introduced into the cavity to raise the sample guide and sample above the level of a substrate on a substrate holder. The substrate holder can be positioned relative to the sample guide so that the sample within the aperture aligns with the substrate on the substrate holder. The rinsingfluid is drained, so that the sample is lowered onto the substrate.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to U.S. Provisional Application No. 62 / 674,715, filed May 22, 2018, which is incorporated herein by reference in its entirety. Background technique [0003] Two-dimensional materials such as graphene are often most conveniently, effectively and / or efficiently created as samples comprising the material of interest immobilized to an initial carrier. However, while a carrier may be most suitable for creating a material of interest, it is often not desirable to have a carrier in subsequent use of the material of interest, such as when manufacturing a device utilizing the material of interest. Therefore, in such cases, it may be necessary to remove the material of interest from the carrier. For example, graphene is typically produced on copper foil, thereby producing the material of interest, ie graphene, on a support, ie copper foil. However, to use graphene effectively, the graphene must b...

AI Technical Summary

Problems solved by technology

Repeated physical handling of the sample (e.g., during one or more etching steps) and / or the material of interest itself (e.g., during one or more rinsing steps) may damage the material of interest, reducing its quality and / or the amount of useful material obtained from the sample

Additionally, while the etching fluid can be formulated to not attack the material of interest as aggressively as the support, overexposure of the material to the etching fluid—such as during physical manipulation of the sample and / or the material itself and / or due to The turbulent flow of the etching fluid causes the etching fluid to splash onto the surface of the material during etching - which can still damage the material, reducing its quality or making it unusable

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