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LED packaging dispensing device

A technology of glue holes and sealing rings, which is applied to the device and coating of the surface coating liquid, which can solve the problems of glue overflowing into the pins, glue not being able to achieve the effect of fixing, and affecting welding quality, etc., to achieve Intact shape, uniform volume and controlled effect

Active Publication Date: 2021-02-09
江苏嘉德光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] An important operation in the LED circuit manufacturing process is to solder the lamp beads to the light strip or board. For the surface mount LED circuit, in order to prevent the lamp beads from shifting during the welding process, it is necessary to use a small amount of glue to The lamp beads are bonded at the welding position. This operation is called dispensing in the industry. The amount of glue used in the dispensing operation usually needs to be strictly controlled. For lamp beads with smaller and smaller sizes, too little glue can not achieve the fixing effect. Too much glue may cause the glue to overflow into the pins and affect the welding quality. Therefore, the dispensing operation usually requires strict control of the amount of glue

Method used

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Embodiment Construction

[0019] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. A preferred embodiment of the invention is shown in the drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present invention will be thorough and complete.

[0020] see Figure 1-Figure 3 The shown LED package dispensing device includes a housing 10, a rotor 20, a bracket 30, an air pipe 40 and a needle tube 50, the rotor 20 is installed on the housing 10, the bracket 30 is connected to the housing 10 and connected to the driving part, and the air pipe 40 Installed on the housing 10, the needle tube 50 is installed under the housing 10 to deliver glue to the board.

[0021] The shell 10 includes a cylinder body 11, a closing area 12, a compression are...

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Abstract

The invention provides an LED packaging dispensing device, and belongs to the technical field of LED circuit manufacturing. The device comprises a casing, a rotor, a support, an air pipe and a needlepipe. The rotor is mounted on the casing, the support is connected with the casing and connected to a driving part, the air pipe is mounted on the casing, and the needle pipe is mounted below the casing. The casing comprises a cylinder body, a closing-in area, a compression area, a packing area, a pressure head, a cover plate and a through hole. The side portion of the cylinder body is connected with the closing-in area, the closing-in area is connected with the compression area, the packing area is connected above the compression area, the pressure head is mounted on the packing area, and thepressure head is upwards connected with an actuating part for extrusion operation. The cover plate is mounted on the cylinder body, the through hole is formed in the side portion of the cover plate,and the air pipe is mounted on the through hole. The rotor comprises a rotary disc, side grooves, glue holes, sliding grooves and a rotating shaft. The rotary disc is mounted in the cylinder body, theside grooves are evenly distributed in the side portion of the rotary disc, the glue holes are further formed in the side portion of the rotary disc, the side grooves communicate with the glue holes,glue enters the glue holes from the side grooves, the glue holes penetrate through the whole rotary disc from top to bottom, and the rotating shaft is arranged at the bottom of the rotary disc and connected with a rotating part.

Description

technical field [0001] The invention belongs to the technical field of LED circuit manufacturing, and in particular relates to a glue dispensing device for LED packaging. Background technique [0002] An important operation in the manufacturing process of LED circuits is to solder the lamp beads to the light strip or board. The lamp beads are bonded at the welding position. This operation is called dispensing in the industry. The amount of glue used in the dispensing operation usually needs to be strictly controlled. For lamp beads with smaller and smaller sizes, too little glue can not achieve the fixing effect. Too much glue may cause the glue to overflow into the pins and affect the welding quality. Therefore, the dispensing operation usually requires strict control of the amount of glue. Contents of the invention [0003] The present invention provides an LED package dispensing device to solve the above-mentioned problems in the background technology. [0004] The te...

Claims

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Application Information

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IPC IPC(8): B05C5/02B05C11/10
CPCB05C5/0208B05C11/10
Inventor 凌丹璐
Owner 江苏嘉德光电科技有限公司
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