Control method for automatically loading heat dissipation parameters and mainboard system

A technology of automatic loading and control methods, which is applied in hardware monitoring, electrical digital data processing, digital data processing parts, etc., can solve the problems of designers' inconvenience, processors cannot be used universally, etc., so as to reduce the development workload, realize heat dissipation and High performance and versatility

Active Publication Date: 2020-12-29
SHENZHEN WEIBU INFORMATION
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Problems solved by technology

The traditional method only configures a set of DPTF parameters (the mechanism used to improve heat dissipation and performance), which is not universal for processors with different thermal design power consumption, and can only configure parameters for each thermal design power consumption, causing designers Inconvenient, but also a risk for users who need to replace the CPU

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  • Control method for automatically loading heat dissipation parameters and mainboard system
  • Control method for automatically loading heat dissipation parameters and mainboard system
  • Control method for automatically loading heat dissipation parameters and mainboard system

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Embodiment Construction

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0018] see figure 1 , an embodiment of a control method for automatically loading heat dissipation parameters in an embodiment of the present invention includes:

[0019] Step S10, acquiring the current TDP power consumption of the electronic device. The electronic equipment of the present invention includes a computer, and the electronic equipment can work with TDP power consumption (Thermal Design Power, thermal design power consumption), so that the CPU of the electronic e...

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Abstract

The embodiment of the invention discloses a control method for automatically loading heat dissipation parameters and a mainboard system. The method comprises the steps of acquiringTDP power consumption of current electronic equipment; setting a numerical value of a preset flag bit based on TDP power consumption, wherein the numerical value represents a heat dissipation type of the electronic equipment; calling a DPTF heat dissipation parameter corresponding to the numerical value according to the numerical value of the preset flag bit, controlling the temperature of the electronic equipment according to the DPTF heat dissipation parameter, calling a first DPTF heat dissipation parameter when the numerical value of the preset flag bit is a first numerical value, and calling a second DPTF heat dissipation parameter when the numerical value of the preset flag bit is a second numerical value, according to the invention, the corresponding DPTF heat dissipation parameters can be loaded according to different TDPs, and the balance between heat dissipation and performance is realized without replacing processors of different TDPs.

Description

technical field [0001] The invention relates to the field of computer heat dissipation control, in particular to a control method for automatically loading heat dissipation parameters and a motherboard system. Background technique [0002] As the current notebook computer market increasingly favors ultra-thin designs, notebooks generate a lot of heat in a limited space. If not effectively controlled, it will seriously degrade the performance of the device. The traditional method only configures a set of DPTF parameters (the mechanism used to improve heat dissipation and performance), which is not universal for processors with different thermal design power consumption, and can only configure parameters for each thermal design power consumption, causing designers Inconvenient, but also a risk to users who need to replace the CPU. Contents of the invention [0003] In view of the above technical problems, embodiments of the present invention provide a control method for aut...

Claims

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Application Information

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IPC IPC(8): G06F1/20G06F11/30
CPCG06F1/206G06F11/3024G06F11/3058Y02D10/00
Inventor 丁永波黄建新张振
Owner SHENZHEN WEIBU INFORMATION
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