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Electronic device and electronic device assembling method

An electronic device and assembly method technology, which is applied in the direction of electrical digital data processing, data processing input/output process, instruments, etc., can solve problems such as poor reliability, damaged ITO lines, and GFF screens cannot work normally, and improve waterproof performance. , Improve reliability and good flow performance

Pending Publication Date: 2020-12-11
OPPO CHONGQING INTELLIGENT TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] In the related art, the GFF screen includes a layer of glass and two layers of film (glass-film-film), wherein the film layer is provided with an ITO (Indium tin oxide, indium tin oxide) circuit. When the GFF screen is assembled, the GFF screen and the shell The gaps are sealed with hot-melt adhesive, but after the hot-melt adhesive is bonded to the GFF screen, the ITO lines on the film are easily damaged by the hot-melt adhesive, causing the GFF screen to fail to work normally, and the overall reliability is poor

Method used

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  • Electronic device and electronic device assembling method
  • Electronic device and electronic device assembling method

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Embodiment Construction

[0020] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, and are only for explaining the present application, and should not be construed as limiting the present application.

[0021] The electronic device 100 according to the embodiment of the present application is described below with reference to the accompanying drawings.

[0022] The electronic device 100 may be a game device, a music player, a storage device, an AR (Augmented Reality, Augmented Reality) device, or a device applied to a car. Additionally, "electronic device 100" as used herein includes, but is not limited to, configured to connect via a wireline connection such as via a public switched telephone network (PSTN), ...

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Abstract

The invention discloses an electronic device and an assembling method of the electronic device. The electronic device comprises a shell which defines an accommodation cavity; a display screen assemblywhich is located in the containing cavity, and an annular gap space is formed by the peripheral wall of the display screen assembly and the side wall of the containing cavity; an adhesive layer whichis located between a bottom wall of the containing cavity and the display screen assembly; and sewing glue which is located in the gap space, and viscosity of the sewing glue is smaller than or equalto 1000cp.s. According to the electronic device, the connection strength of the sewing glue to the display screen assembly and the shell is ensured, and meanwhile, the viscous force between the sewing glue and the display screen assembly can be reduced, sothe display screen assembly can be prevented from being damaged under the traction of the viscous force, and working reliability of the electronic device can be further improved; moreover, the flowing property of the seam glue with the viscosity smaller than or equal to 1000cp.s is good, so seamless filling of the seam space can be achieved,and the waterproof performance of the electronic device can be improved.

Description

technical field [0001] The present application relates to the technical field of electronic devices, in particular to an electronic device and an assembly method of the electronic device. Background technique [0002] In the related art, the GFF screen includes a layer of glass and two layers of film (glass-film-film), wherein the film layer is provided with an ITO (Indium tin oxide, indium tin oxide) circuit. When the GFF screen is assembled, the GFF screen and the shell The gaps are sealed with hot-melt adhesive, but after the hot-melt adhesive is bonded to the GFF screen, the ITO lines on the film are easily damaged by the hot-melt adhesive, causing the GFF screen to fail to work normally, and the overall reliability is poor. Contents of the invention [0003] The present application provides an electronic device, which has the advantage of high reliability. [0004] The present application provides an assembly method of an electronic device, and the electronic device ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/041
CPCG06F3/041
Inventor 钱诚怡
Owner OPPO CHONGQING INTELLIGENT TECH CO LTD
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