A method for manufacturing a pcb with horizontally segmented metallized side walls for display screens
A production method and metallization technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve problems such as quality requirements and difficult manufacturing processes, and achieve the effect of ensuring production efficiency, convenient production, and good quality
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment Construction
[0014] The method for manufacturing a horizontally segmented PCB with a metallized side wall for a display screen according to the present invention will be further described in detail below in conjunction with specific embodiments.
[0015] A PCB manufacturing method for horizontally segmented metallized side walls for display screens, including substrate manufacturing, after the substrates are manufactured, two substrates that have been manufactured are selected, and horizontal segments are placed between the two substrates A segmented layer of grooves, said segmented layer being pressed together with the upper and lower substrates. Specifically, the production of the substrate includes material cutting→drilling→forming and slotting→plate circuit→outer layer graphics→graphic circuit→secondary drilling→etching→external inspection. The same production method is used for two productions to obtain L1 / L2, After the L3 / L4 layer, L1 / L2, and L3 / L4 layers are manufactured, use a gong...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com