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Packaging structure and electronic equipment

A technology of packaging structure and interconnection structure, applied in the field of communication, can solve the problems of slow data interaction and interaction

Inactive Publication Date: 2020-10-30
LYNXI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The embodiment of the present application provides a packaging structure and electronic equipment, which can solve the problem of slow interaction speed in the data interaction between the computing chip and the flash memory chip on the motherboard in the prior art

Method used

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  • Packaging structure and electronic equipment
  • Packaging structure and electronic equipment
  • Packaging structure and electronic equipment

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Embodiment Construction

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0016] The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the application can be practiced in sequences other than those illustrated or described herein. In addition, "and / or" in the specification an...

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Abstract

The invention provides a packaging structure and electronic equipment. The package structure includes a computing chip, a flash memory chip and a first substrate, the computing chip and the flash memory chip are arranged on the first substrate; the computing chip is provided with a first pin, the flash memory chip is provided with a second pin, the first pin is electrically connected with the second pin through a silicon interconnection structure arranged on the first substrate, and the computing chip communicates with the flash memory chip through the silicon interconnection structure. Thus,the data interaction speed between the computing chip and the flash memory chip can be increased.

Description

technical field [0001] The present application relates to the field of communication technology, and in particular to a packaging structure and electronic equipment. Background technique [0002] With the development of technology, more and more chips are installed on the motherboard of intelligent electronic devices, such as flash memory chips, double-rate synchronous dynamic random access memory (Double Date Rate, DDR) chips, computing chips, etc., and various chip settings On the motherboard, and realize the data interaction between different chips through the circuit on the motherboard. However, with the improvement of application requirements, the data interaction speed between existing computing chips and flash memory chips can no longer meet the increasing interaction speed requirements. For example, writing data to DDR chips has problems of slow speed and high power consumption. [0003] It can be seen that in the prior art, the data interaction between the computin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/065H01L23/538G06F15/163
CPCG06F15/163H01L23/538H01L25/0655
Inventor 何伟祝夭龙吴臻志
Owner LYNXI TECH CO LTD
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