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Substrate processing device and substrate processing method

A substrate processing device and a technology for a substrate processing method are applied in the directions of measuring devices, cleaning methods and utensils, chemical instruments and methods, etc., and can solve the problems of uneven processing quality of multiple substrates.

Pending Publication Date: 2020-10-13
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the process of sequentially processing a plurality of substrates, when the surface temperature of each part in the chamber changes, the processing quality for the plurality of substrates may vary.

Method used

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  • Substrate processing device and substrate processing method
  • Substrate processing device and substrate processing method
  • Substrate processing device and substrate processing method

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Experimental program
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Effect test

no. 1 approach ＞

[0048]

[0049] figure 1 It is a plan view of the substrate processing apparatus 100 according to the first embodiment of the present invention. The substrate processing apparatus 100 is an apparatus for supplying a processing liquid to the surface of a disk-shaped substrate W (silicon substrate) to process the surface of the substrate W in a semiconductor wafer manufacturing process. Such as figure 1As shown, the substrate processing apparatus 100 includes an indexer (indexer) 101 , a plurality of processing units 102 and a main transfer robot (robot) 103 .

[0050] The indexer 101 is used to carry in the unprocessed substrate W from the outside and carry out the processed substrate W to the outside. In the indexer 101, a plurality of carriers (carriers) accommodating a plurality of substrates W are arranged. In addition, the indexer 101 includes a transfer robot not shown. The transfer robot transfers the substrate W between the carrier in the indexer 101 and the proce...

no. 2 approach ＞

[0108] Next, a second embodiment of the present invention will be described. In the second embodiment, the structure itself of the substrate processing apparatus 100 is the same as that of the first embodiment, and the processing procedure is also the same except for a part. Hereinafter, overlapping descriptions of the same contents as those in the first embodiment will be omitted.

[0109] Figure 8 It is a flowchart showing the flow of the first processing and the second processing in the second embodiment.

[0110] In the second embodiment, steps S1 to S6 are performed in the same manner as in the first embodiment. That is, first, the model substrate Wd is carried into the chamber 10 (step S1). Next, the first process is performed on the model substrate Wd in the chamber 10 (step S2 to step S4). When the first process ends, the thermal imaging camera 70 measures the temperature of the target area A (step S5). Next, the control unit 80 determines whether or not the seco...

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Abstract

According to the present invention, a first process, which is preprocessing, is performed first in a chamber. When the first process is completed, the temperature of a predetermined target region (A)in the chamber is measured by using a thermographic camera (70). In addition, whether a second process starts to be performed on a substrate (W) is determined on the basis of the obtained temperaturemeasurement information (T1). When it is determined from the result that the second process can be started, the second process is performed. Thus, the second process for the substrate (W) can be started in a state in which the temperature of the target region (A) inside the chamber is stable. Accordingly, the second process can be uniformly performed on a plurality of the substrates (W). In otherwords, process variations due to the temperature environment inside the chamber can be suppressed.

Description

technical field [0001] The present invention relates to a substrate processing device and a substrate processing method for processing a substrate in a chamber. Background technique [0002] Conventionally, in the manufacturing process of a semiconductor wafer, a substrate processing apparatus for supplying a processing liquid to a substrate is used. The substrate processing apparatus supplies a processing liquid such as a photoresist liquid, an etching liquid, a cleaning liquid, or pure water to the substrate while holding the substrate inside a chamber. In such a substrate processing apparatus, in order to maintain stable substrate processing quality, various measurements are performed inside the chamber. [0003] For example, in the apparatus of Patent Document 1, whether or not the processing liquid is discharged to the substrate is photographed by a camera. In addition, in the apparatus of Patent Document 2, the temperature distribution on the substrate surface is det...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304H01L21/027
CPCB05C11/00H01L21/304H01L21/027B05C11/08H01L21/67248H01L21/67051H01L21/67167H01L21/6719B08B3/02H01L21/67034G01J5/0007H01L21/67766
Inventor 深津英司桥本光治藤木博幸井上正史
Owner DAINIPPON SCREEN MTG CO LTD
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