Integrated uniform temperature plate and manufacturing method thereof

Abstract

The invention discloses an integrated uniform temperature plate and a manufacturing method thereof. The uniform temperature plate comprises a shell base, cooling fins, a sealing part and working fluid. The shell base is formed in a drawing or extruding mode and comprises a bottom plate, a top plate and side plates, and a containing cavity is formed among the bottom plate, the top plate and the side plates in a surrounding mode; each radiating fin is formed by extending from the surface, back to the bottom plate, of the top plate. The sealing parts are respectively formed at the head end and the tail end of the accommodating cavity. The working fluid is arranged in the containing cavity. Therefore, the integrated uniform temperature plate disclosed by the invention is easy to manufacture and has a good heat dissipation effect.

Description

technical field [0001] The invention relates to a heat dissipation technology, in particular to an integrated vapor chamber and a manufacturing method thereof. Background technique [0002] As the calculation speed of electronic components continues to increase, the heat generated by them is also increasing. In order to effectively solve the problem of high heat generation, the industry has widely used Vapor Chambers with good thermal conductivity , but there is still room for improvement in the existing vapor chambers in terms of thermal conductivity, manufacturing cost, and manufacturing ease. [0003] A common temperature chamber mainly includes an upper shell and a lower shell, and a capillary structure is respectively installed in the inner space of the upper shell and the lower shell, and then the upper shell and the lower shell are welded together , and then fill the working fluid into the upper shell and the lower shell, and finally perform degassing sealing and oth...

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Problems solved by technology

[0004] However, although the above-mentioned vapor chamber has heat conduction efficiency, there are the following problems in actual use, because the sealing length between the upper casing and the lower casing almost covers each part of the upper casing and the lower casing The length of the side makes the process of welding and sealing quite cumbersome and difficult to process. In addition, during the process of welding and sealing the upper shell and the lower shell, the internal capillary structure is often re-opened due to problems such as high temperature. heating, it is easy to cause peeling or falling off of the upper shell and the lower shell

Moreover, the chamber inside the chamber is constantly changing in temperature and pressure during use, so it is easy to cause the aforementioned problems such as leakage at the sealing welding place

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