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How to make a multilayer circuit board

A technology for multilayer circuit boards and manufacturing methods, which is applied in the directions of multilayer circuit manufacturing, printed circuit manufacturing, and printed circuits, and can solve the problems of multilayer board manufacturing, warping of finished boards, board thickness or plating thickness-to-diameter ratio capabilities Restrictions and other issues to achieve the effect of shortening the production cycle and simplifying the process

Active Publication Date: 2022-06-24
SHANGHAI MEADVILLE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when making multi-layer circuit boards under the original manufacturing method, when the vertical interconnection stack of multi-layer boards is an asymmetric structure, the finished board will have warping problems, which has been difficult to improve
In addition, the production equipment is limited by the thickness of the plate or the thickness-to-diameter ratio of the electroplating, and the equipment is difficult to meet the production of multi-layer boards, such as the situation that it is difficult to press and produce multi-layer boards, etc.

Method used

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  • How to make a multilayer circuit board
  • How to make a multilayer circuit board
  • How to make a multilayer circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] like Figure 1 to Figure 9 As shown, the method for fabricating a multilayer circuit board in this embodiment, this embodiment illustrates that a multi-layer circuit board with an asymmetric structure can be fabricated using the method of the present invention. First, the target multilayer circuit board is divided into two sub-boards, and the two sub-boards are mutually asymmetrical structures, for example, such as figure 1 As shown, the first sub-board 1 is an arbitrary layer interconnect structure, such as figure 2 As shown, the second sub-board 2 is a through-hole interconnection structure. The first sub-board 1 and the second sub-board 2 are each of symmetrical structure, and the first sub-board 1 and the second sub-board 2 are respectively fabricated according to conventional methods. The first sub-board 1 is formed with an A-side graphic layer 3 . The second sub-board 2 is formed with a C-plane pattern layer 5 . The manufacturing method of the multilayer circ...

Embodiment 2

[0052] like Figure 10 As shown in the figure, the manufacturing method of the multilayer circuit board in this embodiment, this embodiment also illustrates that the multilayer circuit board with an asymmetric structure can be manufactured by the method of the present invention. , Take two daughter boards with different layers as an example. First, the target multi-layer circuit board is divided into two sub-boards, namely the third sub-board 13 and the fourth sub-board 14, the third sub-board 13 is a 10-layer board with any layer interconnect structure, the thickness is 2 mm, and the fourth sub-board 14 It is a 6-layer board with a through-blind via interconnect structure with a thickness of 0.5mm. The third sub-board 13 is formed with the E-plane graphic layer 15 , and the fourth sub-board 14 is formed with the F-plane graphic layer 16 . The third sub-board 13 and the fourth sub-board 14 are respectively fabricated using conventional techniques. The conduction and interco...

Embodiment 3

[0062] like Figure 11 As shown, in this embodiment, the thickness of the target multilayer circuit board is 6 mm as an example, which exceeds the capability of the equipment. Therefore, the target multilayer circuit board is divided into three sub-boards with a thickness of 2 mm that can be produced by the equipment, namely the fifth sub-board 19 , the sixth sub-board 20 and the seventh sub-board 21 . The fifth sub-board 19, the sixth sub-board 20 and the seventh sub-board 21 are respectively fabricated by conventional methods. Then, the fifth sub-board 19, the sixth sub-board 20 and the seventh sub-board 21 are connected and interconnected, and the method for conducting and interconnecting the fifth sub-board 19, the sixth sub-board 20 and the seventh sub-board 21 includes the steps:

[0063] Step 1. Referring to Example 1, the first adhesive sheet 7 , the second adhesive sheet 8 and the isolation layer 10 are sequentially arranged on the L-plane graphic layer 22 of the fif...

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Abstract

The invention discloses a method for manufacturing a multi-layer circuit board. Firstly, the target multi-layer circuit board is divided into several sub-boards, and each sub-board is manufactured respectively, and then any two sub-boards are conducted and interconnected. The conduction of the two sub-boards The interconnection method comprises the steps of: arranging a first adhesive layer on a graphic layer of a sub-board, and arranging a second adhesive layer on the first adhesive layer; making a via hole on the sub-board, and the via hole longitudinally penetrates the The second adhesive layer and the first adhesive layer, until the conductive pattern on the graphic layer; filling the conductive paste in the via hole; conducting the sub-board obtained in step 3 with another sub-board pass combination. The invention solves the warping problem of multilayer circuit boards with asymmetric structure. In addition, multi-layer circuit boards whose board thickness or aspect ratio exceeds the capability of the equipment can also be manufactured using the method of the present invention. The invention reduces the production difficulty of high-thickness and high-thickness-diameter-ratio plate electroplating, simplifies the process, and shortens the production cycle of products.

Description

technical field [0001] The invention relates to a manufacturing method of a multi-layer circuit board. Background technique [0002] With the development of electronic products towards miniaturization, high density and multi-function, printed circuit boards are also developing towards the direction of high frequency, high speed and signal transmission integrity. Therefore, the total number of substrate layers is increasing. In this way, any layer interconnect technology has been rapidly developed due to its higher connection density. However, when the multi-layer circuit board is produced under the original manufacturing method, when the longitudinal interconnection and stacking structure of the multi-layer board is an asymmetric structure, the warpage problem of the finished board will occur, and it has been difficult to improve. In addition, the production equipment is limited by the thickness of the board or the aspect ratio of electroplating, and it is difficult for the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/462H05K3/4614H05K2203/061
Inventor 王红月刘涌黄伟陈晓峰谢明樊仁君
Owner SHANGHAI MEADVILLE ELECTRONICS
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