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Automatic laminating device for multilayer circuit board

A multi-layer circuit board and lamination equipment technology, which is applied in multi-layer circuit manufacturing, printed circuit, printed circuit manufacturing, etc., can solve the problem of low efficiency, large manpower consumption, and inability to ensure the matching accuracy of composite multi-layer boards and flexible circuit boards. And other issues

Active Publication Date: 2020-09-01
江苏拓斯达机器人有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in related technologies, workers usually manually press and laminate composite multilayer boards and PET, which not only consumes a lot of manpower, but also has low efficiency under the requirements of high output. Matching accuracy

Method used

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  • Automatic laminating device for multilayer circuit board
  • Automatic laminating device for multilayer circuit board
  • Automatic laminating device for multilayer circuit board

Examples

Experimental program
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Embodiment Construction

[0061] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0062] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0063] In the present in...

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PUM

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Abstract

The invention discloses an automatic laminating device for a multilayer circuit board. The automatic laminating device for the multi-layer circuit board comprises a composite board conveying mechanism, a flexible board conveying mechanism and a laminating mechanism, the composite board conveying mechanism is provided with a feeding station, a material taking station and a discharging station whichare arranged in sequence, and the composite board conveying mechanism is used for conveying a composite circuit board from the feeding station to the material taking station. The flexible board conveying mechanism is provided with a laminating station and is used for conveying the flexible circuit board to the laminating station, the laminating mechanism is used for moving the composite circuit board located at the material taking station to the laminating station to be laminated with the flexible circuit board located at the laminating station, and then the laminated circuit board is conveyed to the discharging station through the laminating mechanism and the composite board conveying mechanism. According to the technical scheme, the composite circuit board and the flexible circuit boardcan be automatically laminated, the production takt and the yield are greatly improved, the laminating precision is ensured, and meanwhile, the manual operation intensity is effectively reduced.

Description

technical field [0001] The invention relates to the technical field of automation equipment, in particular to an automatic pressing equipment for multilayer circuit boards. Background technique [0002] With the development of science and technology, the printed circuit board (Printed Circuit Board, referred to as PCB) manufacturing industry has developed rapidly. The manufacturing level is constantly developing towards high precision, high density and high reliability. During the preparation process of the multilayer board, it is necessary to carry out a step of pressing and assembling with a flexible circuit board (Polyethyleneterephthalate, PET for short). However, in related technologies, workers usually manually press and laminate composite multilayer boards and PET, which not only consumes a lot of manpower, but also has low efficiency under the requirements of high output. Matching precision. [0003] The above content is only used to assist in understanding the te...

Claims

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Application Information

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IPC IPC(8): H05K3/46B65G49/06
CPCB65G49/06B65G49/061B65G49/067H05K3/4611H05K2203/0147
Inventor 陈开放吴丰礼王恒基于水才
Owner 江苏拓斯达机器人有限公司
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