Test method and device of semiconductor temperature control device, electronic equipment and storage medium

A technology of temperature control device and testing method, which is applied in the field of control, can solve the problems of low degree of automation, achieve the effect of improving efficiency and reducing the degree of manual participation

Active Publication Date: 2020-08-11
BEIJING JINGYI AUTOMATION EQUIP CO LTD
View PDF9 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present invention provide a testing method and device for a semiconductor temperature control device, which are used to solve the defects in the prior art that require manual operation of each testing process and have a low degree of automation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Test method and device of semiconductor temperature control device, electronic equipment and storage medium
  • Test method and device of semiconductor temperature control device, electronic equipment and storage medium
  • Test method and device of semiconductor temperature control device, electronic equipment and storage medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0051] A schematic diagram of a specific implementation of the testing method of the semiconductor temperature control device provided by the embodiment of the present invention is as follows figure 1 As shown, the method includes:

[0052] Step S101: Determine preset test parameters for at least one test temperature point; the preset test parame...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The embodiment of the invention provides a test method and device of a semiconductor temperature control device, electronic equipment and a storage medium. The method comprises the steps of determining a preset test parameter of at least one test temperature point; controlling the semiconductor temperature control device to operate according to preset test parameter, and collecting an actual temperature value of the test temperature point; and generating a test result at least comprising the actual temperature value. According to the embodiment of the invention, a mode that a test link needs to be manually operated in the prior art is changed, the manual participation degree is reduced, and the debugging efficiency is improved.

Description

technical field [0001] The invention relates to the field of control technology, in particular to a testing method, device, electronic equipment and storage medium of a semiconductor temperature control device. Background technique [0002] The semiconductor temperature control device is used to provide stable flow and stable temperature circulating liquid in the integrated circuit manufacturing process. In the prototype testing stage, mass production debugging, and data comparison of different models, a lot of debugging and functional verification tests are required, including EXP debugging at each temperature point, comparison of temperature curves of different devices, no-load testing, load testing, Heating test, etc. In the prior art, each test requires manual operation of each link, and the degree of automation is relatively low. [0003] In view of this, it is very necessary to provide a testing method and device for a semiconductor temperature control device that re...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G05B23/02H01L21/67
CPCG05B23/0213G05B2219/24065H01L21/67248
Inventor 常鑫冯涛李文博董春辉芮守祯何茂栋曹小康
Owner BEIJING JINGYI AUTOMATION EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products