Die device

Abstract

The invention provides a die device. The die device comprises a die holder, at least one die core, a plurality of fluid pipelines and at least one guide plate, wherein the die holder is provided witha first side and a second side which are opposite to each other, a groove is formed in the first side of the die holder, and the die core is arranged between the first side and the second side; the fluid pipelines are arranged on the die holder in a penetrating mode to generate fluid circulation changing the temperature of the die core, and the ends, corresponding to the first side, of the fluid pipelines are positioned in the groove; and the guide plate is fixed to the die holder, at least one flow channel is defined by the guide plate and the first side of the die holder, and the ends, corresponding to the first side, of the fluid pipelines communicate with the flow channel.

Description

technical field [0001] The present invention relates to a mold device. Background technique [0002] In the current injection molding process of light guide plates, multi-cavity molds are often used to improve production efficiency. However, in the design of one mold with two or more mold cavities, it is necessary to control the mold temperature stably and avoid the problem of water overflow or leakage of the cooling water pipe. figure 1 The liquid circulation system design of a known mold assembly is shown. like figure 1 As shown, when the number of mold cavities 102 of the mold device 100 increases, there will be more external water pipes 104, which will easily cause damage to the external water pipes 104 during the process of water pipe disassembly, transportation, and upper and lower molds, resulting in water seepage or water leakage. If water seepage or water leakage is detected in time, the mold core will form water stains and rust spots or even rust damage when exp...

AI Technical Summary

Problems solved by technology

like figure 1 As shown, when the number of mold cavities 102 of the mold device 100 increases, there will be more external water pipes 104, which will easily cause damage to the external water pipes 104 during the process of water pipe disassembly, transportation, and upper and lower molds, resulting in water seepage or water leakage. If water seepage or leakage is detected in time, the mold core will form water stains, rust spots or even rust damage when exposed to moisture for a period of time, resulting in increased repair time and expensive repair costs

Furthermore, because the external water pipe is exposed, it takes a long time to raise and lower the temperature of the mold, and cannot provide stable mold temperature control

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