Automatic edge sealing device and technology capable of primarily positioning adhesive tape for solar cell double-glazed module

Abstract

The invention belongs to the technical field of automatic production equipment of solar cell modules and particularly relates to an automatic edge sealing device and technology capable of primarily positioning an adhesive tape for a solar cell double-glazed module. According to the automatic edge sealing device and technology capable of primarily positioning the adhesive tape for the solar cell double-glazed module, the structure is simple, the degree of automation is high, the technology is simple and manpower is saved. The automatic edge sealing device capable of primarily positioning the adhesive tape for the solar cell double-glazed module comprises an edge sealing head and is characterized in that the edge sealing head comprises a bracket, wherein an adhesive tape roll and a tape guide wheel set corresponding to the adhesive tape roll are arranged on the bracket, and an upper compressing roller assembly, a folding roller assembly, a shaping roller assembly, an edge covering rollerassembly and a lower compressing roller assembly are sequentially arranged on the bracket in a mode of corresponding to the tape guide wheel at the tail end; and the adhesive tape roll is parallel toa rotating shaft of an upper compressing roller of the upper compressing roller assembly of the tape guide wheel set.

Description

technical field [0001] The invention belongs to the technical field of automatic production equipment of solar cell modules, and in particular relates to a solar cell double-glass module adhesive tape first positioning type automatic edge sealing device and its edge sealing process. Background technique [0002] In the automatic packaging process of conventional double-glass solar cell modules, the requirements for both the quality of the edge banding and the reliability of the edge banding device are getting higher and higher. Because the module can be manufactured with a glass thickness ranging from 2mm to 4mm, and an EVA thickness ranging from 0.5mm to 1mm. The thickness of the material selected by different manufacturers is different, so the width of the adhesive tape on the glass surface is also different. The current common edge banding device is difficult to meet the requirements of the edge banding process, which is mainly manifested in two aspects: on the one hand,...

AI Technical Summary

Problems solved by technology

The current common edge banding device is difficult to meet the requirements of the edge banding process, which is mainly manifested in two aspects: on the one hand, the edge banding effect of the tape is unqualified in many ways, 1. The tape is not pasted in place, and the end is detached from the component; 2. The adhesive tape is biased, and the vent hole on the tape is dislocated up and down, resulting in the vent hole being blocked, which will directly lead to the scrapping of the component (ensuring the position of the tape vent hole is of great significance to the thermal packaging of the component); 3. The tape is in the component The flatness and consistency of the upper and lower glass surfaces also directly affect the overflow effect of EVA hot melting

The width of the upper and lower glass tapes is not equal, the tape is separated from the glass, and the tape is wrinkled, etc., all of which affect the packaging quality of the dual-wave module

On the other hand, in the edge banding process, every process link that the tape passes through cannot be controlled, resulting in greatly reduced reliability of the edge banding, and there are obvious differences in the shape of the paste, resulting in quality problems such as folds, slack, and irregular shapes of the edge banding. occur

[0003] In addition, due to the limitation of the structure of the existing edge banding device, the edge banding process is cumbersome, the production cycle is slow, and the efficiency is low

It can be seen that the structure of the edge banding device of the dual-wave module is complicated, and the edge banding process is cumbersome, time-consuming and laborious, which are the main disadvantages that lead to prolonged production cycle time and low production efficiency

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