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APPARATUS FOR PROCESSING substrate

A substrate processing device and substrate technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of polluting the substrate, polluting the inside of the main body, etc., and achieve the effects of improving temperature deviation, improving reliability and yield

Active Publication Date: 2020-06-23
WONIK IPS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The condensed gas evaporates or condenses repeatedly in the repeated substrate processing process, or reacts with gases of other chemical components, or deteriorates in a specific temperature environment, and further contaminates the interior of the main body, and flows to the substrate, contaminating the substrate. question

Method used

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  • APPARATUS FOR PROCESSING substrate
  • APPARATUS FOR PROCESSING substrate
  • APPARATUS FOR PROCESSING substrate

Examples

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Embodiment Construction

[0063] For the detailed description of the present invention to be described later, reference is made to the accompanying drawings, which illustrate specific embodiments in which the present invention can be implemented. These embodiments are described in detail so that those skilled in the art can fully practice the present invention. For the various embodiments of the present invention, it should be understood that they are different from each other but not necessarily mutually exclusive. For example, specific shapes, structures, and characteristics described herein may be implemented by other embodiments without departing from the spirit and scope of the invention. In addition, it should be understood that the position or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the present invention. Therefore, the following detailed description is not intended to be limiting, and the scope of the p...

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Abstract

The invention discloses an apparatus for processing a substrate. The apparatus controls gas flow during a substrate processing process, improves temperature uniformity and prevents particles from flowing in a processing space.

Description

technical field [0001] The present invention relates to a substrate processing device, and more specifically, relates to a substrate processing device that controls gas flow during a heat treatment process to improve temperature uniformity and prevent particles from flowing into a processing space. Background technique [0002] In a substrate processing apparatus used for manufacturing a display device or a semiconductor element, a large amount of gas may be discharged or supplied inside a processing space for processing a substrate. Such a gas may be supplied inside the processing space for the purpose of forming a thin film on the substrate or forming a pattern on the thin film of the substrate, ventilating the internal environment of the processing space, and the like. After the substrate processing process is completed, the gas inside the processing space may be exhausted to the outside. [0003] In order to obtain high quality products in the heat treatment process, it...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67017H01L21/67109
Inventor 崔宇镕李学文朴暻完金东均李成熙金建昊朴大善张城民郑盈箕
Owner WONIK IPS CO LTD
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