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Optical sensor module and forming method thereof

An optical sensor and module technology, which is used in instruments, character and pattern recognition, printing image acquisition, etc., and can solve the problem that the performance of optical sensor modules needs to be improved.

Active Publication Date: 2020-06-23
SHANGHAI OXI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the performance of existing optical sensor modules needs to be improved

Method used

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  • Optical sensor module and forming method thereof
  • Optical sensor module and forming method thereof
  • Optical sensor module and forming method thereof

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Experimental program
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Effect test

Embodiment Construction

[0029] As mentioned in the background, prior art optical sensor modules have poor performance.

[0030] An optical sensor module, reference figure 1 , comprising: a self-luminous display panel 100; an optical sensor 110; a light collimation layer 120 between the self-luminous display panel 100 and the optical sensor 110; a light collimation layer between the light collimation layer 120 and the optical sensor 110 120 and the adhesive layer 130 between the self-luminous display panel 100 .

[0031] The material of the adhesive layer 130 is optical glue, and the adhesive layer 130 is solid after being cured.

[0032] The adhesive layer 130 bonds the self-luminous display panel 100 and the optical sensor 110, avoiding the existence of an air layer between the self-luminous display panel 100 and the optical sensor 110, and avoiding light scattering caused by the air layer, thereby improving The sharpness of the image from the optical sensor is improved.

[0033] After bonding th...

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Abstract

The invention discloses an optical sensor module and a forming method thereof. The optical sensor module comprises a self-luminous display panel; the optical sensor which is arranged opposite to the self-luminous display panel and comprises a sensing pixel area and a sensing edge area surrounding the sensing pixel area; the first optical bonding structure which is located between the optical sensor and the self-luminous display panel, the first optical bonding structure comprises a first bonding frame and a first light-transmitting liquid layer located in the first bonding frame, the first bonding frame is located on the surface of the sensing edge area, and the first light-transmitting liquid layer is located on the surface of the sensing pixel area. The performance of the optical sensormodule is improved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to an optical sensor module and a forming method thereof. Background technique [0002] Fingerprint imaging recognition technology is to collect the fingerprint image of the human body through the optical fingerprint sensor, and then compare it with the existing fingerprint imaging information in the system to judge whether it is correct or not, and then realize the technology of identity recognition. Due to its ease of use and the uniqueness of human fingerprints, fingerprint imaging recognition technology has been widely used in various fields, such as security inspection fields such as public security bureaus and customs, building access control systems, and consumer products such as personal computers and mobile phones. [0003] The imaging methods of fingerprint imaging recognition technology include optical imaging, capacitive imaging, ultrasonic imaging and other te...

Claims

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Application Information

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IPC IPC(8): G06K9/00G09F9/33
CPCG09F9/33G06V40/1318
Inventor 陆震生朱虹
Owner SHANGHAI OXI TECH
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