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Housing processing method, housing and electronic equipment

A processing method and technology of electronic equipment, applied in the direction of electrical equipment shell/cabinet/drawer, electrical components, printing process, etc., can solve the problems of too thick electroplating film, film cracking, weak metal luster, etc. weak effect

Active Publication Date: 2021-05-07
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

In related technologies, electroplating process is usually used to make the outer shell of electronic equipment have a metallic luster. However, the electroplating film formed by electroplating process should not be too thick, otherwise, it is easy to cause film cracks during 3D high-pressure molding, and then the formed product Weak metallic luster due to insufficient plating film thickness

Method used

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  • Housing processing method, housing and electronic equipment
  • Housing processing method, housing and electronic equipment
  • Housing processing method, housing and electronic equipment

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Embodiment Construction

[0019] The technical solutions in the embodiments of the application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, not all of them, and The embodiments listed in this application may be properly combined with each other. Based on the implementation manners in this application, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0020] In related technologies, electroplating process is usually used to make the outer shell of electronic equipment have a metallic luster. However, the electroplating film formed by electroplating process should not be too thick, otherwise, it is easy to cause film cracks during 3D high-pressure molding, and then the formed product The metallic luster is weak ...

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Abstract

The present application provides a processing method for a casing, a casing and an electronic device. The processing method includes: providing a transparent substrate; coating an optical material on the surface of the substrate to form a substrate with metallic luster; Forming the metallic luster substrate; cutting the formed substrate to form the shell. The present application provides a processing method for a shell, and the shell made by the processing method can exhibit strong metallic luster.

Description

technical field [0001] The present application relates to the field of electronic equipment manufacturing, in particular to a processing method for a housing, the housing and electronic equipment. Background technique [0002] Electronic devices with a metallic luster appearance are becoming more and more popular. In related technologies, electroplating process is usually used to make the outer shell of electronic equipment have a metallic luster. However, the electroplating film formed by electroplating process should not be too thick, otherwise, it is easy to cause film cracks during 3D high-pressure molding, and then the formed product The metallic luster is weak due to insufficient plating film thickness. Contents of the invention [0003] The present application provides a processing method for a shell, and the shell made by the processing method can exhibit strong metallic luster. [0004] The application provides a processing method for a housing, the processing m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/02B41M1/12B41M1/30B41M3/06
CPCB41M1/12B41M1/30B41M3/06H05K5/0243
Inventor 肖博
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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