A multi-size compatible wafer grinding equipment

A multi-size and equipment technology, applied in grinding machine tools, grinding devices, metal processing equipment, etc., can solve the problems of thin water layer discovery, tedious and time-consuming processing of water layer, unfavorable processing and use, etc., to achieve the effect of flexible protection

Active Publication Date: 2021-06-29
广西自贸区见炬科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Wafer grinding is taken out from the storage box by the conveyor and transferred to the alignment table, and then the grinding tool starts to grind. In the southern region, the environment is too humid, especially in the south, due to the removal of the storage box The grinding chamber 1 where the wafer is placed is not absolutely sealed, which makes it very easy for humid air to enter the grinding chamber 1. When the internal environment is damp, a thin layer of moisture will be formed on the surface of the alignment table At this time, when the moisture layer of the alignment table is directly ground, the back of the wafer will be damp, which is not conducive to post-processing. However, the alignment table is placed inside the grinding chamber 1, and the thin moisture layer is not easy to be found. Dealing with the water layer is also more cumbersome and time-consuming

Method used

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  • A multi-size compatible wafer grinding equipment
  • A multi-size compatible wafer grinding equipment
  • A multi-size compatible wafer grinding equipment

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Experimental program
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Effect test

Embodiment 1

[0030] like Figure 1-Figure 4 As shown, the present invention provides a multi-size compatible wafer grinding equipment, the structure of which includes a grinding chamber 1, a support platform 2, and a control cabinet 3. The grinding chamber 1 is provided with a lifting rod 4, a grinding disc 5, Alignment table 6, the lift rod 4 and the grinding disc 5 are mechanically connected, the grinding disc 5 is arranged on the upper end of the alignment table 6, there are two grinding discs 5, the grinding processing chamber 1 The signal end of the control box 3 is electrically connected to the signal output end of the control box 3, and the support platform 2 is horizontally fixed between the grinding chamber 1 and the control box 3,

[0031] The alignment table 6 is provided with a push-out shaft 61 , a meshing pattern 62 , a sliding cover 63 , a stage 64 , and a cover side sliding mechanism 65 . The sliding cover 63 is covered on the stage 64 by the horizontal sliding mechanism 6...

Embodiment 2

[0033] like Figure 5-Figure 7As shown, based on the moisture-proof foundation of Embodiment 1, the sliding cover body 63 is composed of a magnetic ring 631, a magnetic disk 632, and a cover surface 633, and the cover surface 633 is located at one end of the push-out shaft 61. The magnetic ring 631 and the magnetic disk 632 are mutually different magnets, and they are adsorbed and fixed. The magnetic disk 632 is arranged inside the empty slot, and there are four magnetic disks 632, each of which is arranged on the same side. Pleated structure, the cover surface 633 is located at the upper part of the empty groove after shrinking to form a circular plane with the stage 64, the telescopic cylinder 653 is multi-stage, and the height change distance is the distance between the sliding cover 63 when the stage 64 is opened The distance is the same, that is to say, the sliding cover 63 can be used to open the stage 64 well by the driving of the telescopic cylinder 653. The push-out s...

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Abstract

The invention discloses a multi-size compatible wafer grinding equipment. Its structure includes a grinding processing cavity, a support platform and a control cabinet. The grinding processing cavity is provided with a lifting rod, a grinding disc and an alignment table. The lifting rod and the grinding disc are two parts. The grinding disc is set on the upper end of the alignment table, and there are two grinding discs. The signal end of the grinding chamber and the signal output end of the control box are electrically connected, and the support platform is horizontally fixed on the grinding chamber and the control box. Between the chassis, the alignment table is provided with a push-out shaft, a meshing pattern, a sliding cover, a carrier, and a side sliding mechanism of the cover. In the present invention, a sliding cover is provided on the carrier, and the cover on the sliding cover The surface is completely covered and tightly attached to the side of the carrier that carries the wafer, and the side of the carrier is completely isolated from the outside world, which has a protective effect, and the close contact of the two can place moist air. String it in, making sure it's dry enough.

Description

technical field [0001] The invention relates to the technical field of wafer processing, in particular, to a multi-size compatible wafer grinding device. Background technique [0002] Wafers are the raw materials for manufacturing LED chips. During the manufacturing process of wafers, they need to be ground and polished to improve the surface flatness. Wafer grinder is a processing machine specially used to grind the surface of wafers. It is to install a lift seat that can be lifted in a straight line and a carrier that can be shifted horizontally on a machine table. The lift seat is also equipped with a rotatable grinding wheel, and the wafer is placed on the carrier. On the top, through the lifting and lowering of the lifting seat and the horizontal movement of the stage, the grinding wheel can be pressed against the surface of the wafer, and the grinding process can be performed. [0003] Wafer grinding is taken out from the storage box by the conveyor and transferred to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/10B24B37/30B24B37/34
CPCB24B37/10B24B37/30B24B37/34B24B37/345
Inventor 陈丽娥徐绪友
Owner 广西自贸区见炬科技有限公司
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